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    <title>Recent lma_pmg items</title>
    <link>https://escholarship.org/uc/lma_pmg/rss</link>
    <description>Recent eScholarship items from Precision Manufacturing Group</description>
    <pubDate>Fri, 11 Sep 2026 03:14:04 +0000</pubDate>
    <item>
      <title>Designing Imprint Rolls for Fluid Pathway Fabrication</title>
      <link>https://escholarship.org/uc/item/5rk639tt</link>
      <description>This paper discusses a novel method for designing imprint rolls for the fabrication of fluid pathways. Roller imprint processes have applications in diverse areas including fuel cell manufacturing and microfluidic device fabrication. Robust design methods are required for developing imprint rolls with optimal features. In the method discussed in this paper, the rolls are designed procedurally with the fluid pathway design given as input. The pathways are decomposed into repeating features (or tiles), and the rolls are designed by first modeling a small set of unique tiles and then combining them to model the entire roll. The tiling strategy decreases the complexity of the model, and reduces the time taken for designing the rolls. The modular nature of the tiles also improves the efficiency of post-processing operations like feature identification and optimization, and the generation of toolpaths for machining the roll.</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/5rk639tt</guid>
      <pubDate>Mon, 29 Oct 2012 00:00:00 +0000</pubDate>
      <author>
        <name>Vijayaraghavan, Athulan</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Precision Manufacturing of Imprint Rolls for the Roller Imprinting Process</title>
      <link>https://escholarship.org/uc/item/00s0d8v2</link>
      <description>The roller imprinting process is being developed for the efficient and accurate fabrication of microfluidic devices. As the precision of the imprinted features is dependent on the features of the imprint rolls used in the process, it is critical that the rolls are manufactured very accurately, conforming closely to their design. It is also important that imprint rolls are manufactured rapidly and cost-effectively to control the cost and lead-time of roller imprinting. This paper looks at the application of micromachining technology in the manufacturing of imprint rolls. Sources of error during the manufacturing process are identified, and their effect on the precision of the final imprinted feature is discussed. Toolpath planning strategies are presented for generating very smooth surfaces. The paper presents a framework of precision manufacturing requirements for the roller imprinting process.</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/00s0d8v2</guid>
      <pubDate>Mon, 29 Oct 2012 00:00:00 +0000</pubDate>
      <author>
        <name>Vijayaraghavan, Athulan</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
      <author>
        <name>Kim, Chang-Ju</name>
      </author>
    </item>
    <item>
      <title>A model of material removal and post process surface topography for copper CMP</title>
      <link>https://escholarship.org/uc/item/2gz0f5hg</link>
      <description>&lt;p&gt;Increasing systemic error during copper CMP (Chemical Mechanical Planarization) is due to the uneven surfacetopography generated during the process. A mechanistic model based on a fundamental understanding of the processconstituents was proposed to predict material removal rates and the post CMP topography. Two synergisticmechanisms were proposed: 1) chemically dominant behavior is explained by the repetitive removal and formation ofa protective layer on copper surface and chemical dissolution during the process, 2) mechanically dominant removalmechanism is due to the material behavior of copper at the nano-scale and subsequent oxidation and removal of theplastically deformed copper. As a step forward to optimize the process and the manufacturing system, this model wasextended to explain pattern dependent variability during copper CMP.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/2gz0f5hg</guid>
      <pubDate>Thu, 22 Mar 2012 00:00:00 +0000</pubDate>
      <author>
        <name>Choi, Seungchoun</name>
      </author>
      <author>
        <name>Doyle, Fiona M.</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>DESIGN AND FABRICATION OF A ROLLER IMPRINTING DEVICE FOR MICROFLUIDIC DEVICE MANUFACTURING</title>
      <link>https://escholarship.org/uc/item/88h5r4qw</link>
      <description>&lt;p&gt;Microfluidic devices are gaining popularity in a variety of applications, ranging from molecular biology to bio-defense. However, the widespread adoption of this technology is constrained by the lack of efficient and cost-effective manufacturing processes. This paper focuses on the roller imprinting process, which is being developed to rapidly and inexpensively fabricate micro-fluidic devices. In this process, a cylindrical roll with raised features on its surface creates imprints by rolling over a fixed workpiece substrate and mechanically deforming it. Roller imprinting aims to replace processes that were developed for laboratory scale prototyping which tend to not be scalable and have high equipment requirements and overheads. We discuss the limitations of PDMS soft lithography in large-scale manufacture of microfluidic devices. We also discuss the design, fabrication, and testing of a simple roller imprinting device. This imprinter has been developed based on the principles...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/88h5r4qw</guid>
      <pubDate>Thu, 20 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Vijayaraghavan, Athulan</name>
      </author>
      <author>
        <name>Jayanathan, Stephen</name>
      </author>
      <author>
        <name>Helu, Moneer</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>ADDRESSING PROCESS PLANNING AND VERIFICATION ISSUES WITH MTCONNECT</title>
      <link>https://escholarship.org/uc/item/73g339j3</link>
      <description>&lt;p&gt;Robust interoperability methods are needed in manufacturing systems to implement computeraided process planning algorithms and to verify their effectiveness. In this paper we discuss applying MTConnect, an open-source standard for data exchange in manufacturing systems, in addressing two specific issues in process planning and verification. We use data from an MTConnect-compliant machine tool to estimate the cycle time required for machining complex parts in that machine. MTConnect data is also used in verifying the conformance of toolpaths to the required part features by comparing the features created by the actual tool positions to the required part features using CAD tools. We demonstrate the capabilities of MTConnect in easily enabling process planning and verification in an industrial environment.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/73g339j3</guid>
      <pubDate>Thu, 20 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Vijayaraghavan, Athulan</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Artisanal Software</name>
      </author>
      <author>
        <name>Remmele Engineering Inc.</name>
      </author>
    </item>
    <item>
      <title>CMP Modeling as a part of Design for Manufacturing</title>
      <link>https://escholarship.org/uc/item/1kj2b95j</link>
      <description>&lt;p&gt;CMP faces numerous challenges, as we move towards 45-nm and 32-nm nodes. The most important of these, as identified by ITRS [1], are: a) reliably predicting and controlling post-CMP topography (dishing and erosion loss should be limited to within 10% of the interconnect height throughout the die); b) Integration of ultra low-K&lt;/p&gt;&lt;p&gt;dielectric materials, including predicting stresses and damage, and designing very low stress polishing processes; and c) designing new planarization processes for new materials and new requirements.&lt;/p&gt;&lt;p&gt;To address these, a multi-scale (feature/die/wafer) CMP modeling framework is being developed for enabling Design for Manufacturing (DfM) and Manufacturing for Design (MfD). Topographic evolution has been studied for Shallow Trench Isolation CMP and is now being extended to copper CMP. A detailed, quantitative understanding of the mechanism(s) of CMP is being elucidated, using fundamental experiments and a mechanistic model based on physical data....</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/1kj2b95j</guid>
      <pubDate>Thu, 20 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Tripathi, Shantanu</name>
      </author>
      <author>
        <name>Monvoisin, Adrien</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Doyle, F M</name>
      </author>
    </item>
    <item>
      <title>Surface finishes from turning and facing with round nosed tools</title>
      <link>https://escholarship.org/uc/item/9mp099gw</link>
      <description>&lt;p&gt;The range of surface roughnesses, and particularly the minimum roughnesses, achievable mainly with cemented carbide but also with single crystal diamond round nosed turning and facing inserts, has been experimentally studied, machining aluminium on engineering and precision lathes. Insert edge sharpness and roughness measurements and characteristic variations with feed rate of machined surface profile are presented. When machine tool limits are avoided, Rz values down to 0.02 times the insert edge radii have been obtained.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/9mp099gw</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Childs, THC</name>
      </author>
      <author>
        <name>Sekiya, Katsuhiko</name>
      </author>
      <author>
        <name>Tezuka, Ryo</name>
      </author>
      <author>
        <name>Yamada, Keiji</name>
      </author>
      <author>
        <name>Yamane, Yasuo</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Wright, Paul</name>
      </author>
    </item>
    <item>
      <title>A study on initial contact detection for precision micro-mold and surface generation of vertical side walls in micromachining</title>
      <link>https://escholarship.org/uc/item/9dx0w8gz</link>
      <description>&lt;p&gt;The surface quality and the dimensional accuracy are important criteria for micro-mold production, specially for micro-fluidic devices. Important cutting parameters that affect the quality of vertical side walls created by the peripheral cutting edge in micro-end-milling operations were identified. Surface roughness and form error were used to define the quality of side walls on stainless steel and aluminum workpieces. An acoustic emission sensor was used to detect initial contact between a tool and a workpiece for higher dimensional accuracy where the referencing is a critical element for precision micromachining feature creation.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/9dx0w8gz</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Sangermann, Hubertus</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Geometric Approaches for Reducing Burr Formation in Planar Milling by Avoiding Tool Exits</title>
      <link>https://escholarship.org/uc/item/8x62k046</link>
      <description>&lt;p&gt;One of the most effective methods for reducing milling exit burrs is to prevent the tool from exiting the workpiece. Exit here refers the condition in which a cutting edge is moving out of the workpiece while removing material. Only entrance burrs can occur under this circumstance, which are usually considered burr-free. This study proposes a set of geometric algorithms for avoiding tool exits in planar milling. Two distinct approaches are developed for tool path planning of 2-D polygons. The first approach generates exit-free tool paths by offsetting the workpiece edges with appropriate widths of cut. The second one adjusts tool positions locally on given tool paths. In addition, a two-stage algorithm is designed for 2-D free-form contours. The cutter locations causing the tool to exit the workpiece are first detected; then a heuristic scheme is applied to generate new cutter locations with no tool exits. Experimental results show that edge quality is significantly improved...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/8x62k046</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Chu, Chih-Hsing</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Subdivision Surfaces for Procedural Design of Optimal Imprint Rolls</title>
      <link>https://escholarship.org/uc/item/8d02d2dd</link>
      <description>&lt;p&gt;We discuss the use of subdivision surfaces in the procedural design of imprint rolls for use in the roller imprinting process. Roller imprinting is being developed for the fabrication of microfluidic devices in polymer substrates. Imprint rolls are modeled using Catmull-Clark subdivision surfaces, and are procedurally designed based on feedback from finite-element simulations of the imprinting process. Microfluidic devices exhibit repeating patterns, and can be modeled using a small set of unique entities (or tiles). Imprint rolls are also modeled as a sum of tiles, and rolls are designed by studying the imprinting behavior of clusters of tiles corresponding to the repeating patterns seen in the device. This approach reduces the roll complexity and analysis time. The rolls need to be described in a sufficiently flexible format for the tile-based analysis to be effective. Conventional model representations are too cumbersome for piecewise iterative refinement as they require...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/8d02d2dd</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Vijayaraghavan, Athulan</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process</title>
      <link>https://escholarship.org/uc/item/7xx6j4s5</link>
      <description>&lt;p&gt;The strong Ce-O-Si bonding between CeO2 abrasives and SiO2 film surface; i.e., the chemical tooth effect, improved planarization efficiency in CMP using ceria-based slurry as a result of nonlinear behavior of the removal rate. Removal rate is a power function of pressure and relative velocity (i.e., RR = kPαV β ). In particular, the high dependency of removal rate on pressure when α &amp;gt;1 results in a much higher material removal rate in the upper pattern than in the lower pattern. Therefore, the planarization efficiency of ceriabased slurry is better, from initial polishing time to the completion of the polishing step, than that of conventional silica-based slurry with an exponent value of α ≈1.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/7xx6j4s5</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Park, Boumyoung</name>
      </author>
      <author>
        <name>Youngjin Kim</name>
      </author>
      <author>
        <name>Hyoungjae Kim</name>
      </author>
      <author>
        <name>Jeong, Haedo</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Improvingendmillingsurfacefinishbyworkpiecerotationandadaptive toolpathspacing</title>
      <link>https://escholarship.org/uc/item/72h3d5nw</link>
      <description>&lt;p&gt;Free-form surfaces are being used in a growing number of engineering applications, especially in injection molding of consumer products. Decreasing the manufacturing cost and time of these molds will improve the efficiency of manufacturing injection molded consumer products. This paper is motivated by the need for simple strategies to improve the quality of and decrease the time required to machine free-form surfaces. We present two methods to improve the surface finish of parts finished with ball-nose endmilling. In the first method the surface finish is improved by finding an optimal orientation angle for the workpiece relative to the machining axis. In the second method finish is improved by adaptively varying the step-size when using raster toolpaths. The adaptive variation is controlled by a user-defined finish improvement factor, where the spacing density is increased only if the improvement in surface finish is greater than the finish improvement factor. These methods...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/72h3d5nw</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Vijayaraghavan, Athulan</name>
      </author>
      <author>
        <name>Hoover, Aaron</name>
      </author>
      <author>
        <name>Hartnett, Jeffrey</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Modification of surface properties on a nitride based coating films through mirror-quality finish grinding</title>
      <link>https://escholarship.org/uc/item/6dh3x4qr</link>
      <description>&lt;p&gt;In this study, we performed a specific precision grinding process in an attempt to improve the mirror-quality finish and tribological characteristics of titanium nitride based coating films (TiN, TiCN, and TiAIN). The ground surfaces were highly smooth with no evidence of cracking, chipping, or peeling, demonstrating that the hard coating films were finished uniformly. For the TiAIN coating, a significant high level mirror-quality finish was achieved with an average roughness Ra of 4 nm. In addition, for all films, the employed grinding process led to superior tribological characteristics. In the case of the TiN film, the precision grinding process produced a carbon- and copper-rich surface layer, as well as higher compressive residual stress.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/6dh3x4qr</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Katahira, K.</name>
      </author>
      <author>
        <name>H. Ohmori</name>
      </author>
      <author>
        <name>J. Komotori</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>H. Kotani</name>
      </author>
      <author>
        <name>M. Mizutani</name>
      </author>
    </item>
    <item>
      <title>Modeling and simulation of material removal with particulate flows</title>
      <link>https://escholarship.org/uc/item/602066ws</link>
      <description>&lt;p&gt;In this work a multibody collision model, amenable to large-scale computation, is developed to simulate material removal with particulate flows. This model is developed by computing momentum exchange to account for different force interactions: (1) particle–particle interaction, (2) particle–fluid interaction, and (3) particle–surface interaction. For the particle-fluid interaction, a velocity field for the fluid is assumed to be known, and the drag force on the particles is computed from this field. In the particle–surface interaction, the Boussinesq solution for a point load on an elastic half-space is used along with the von-Mises yield criterion to determine the amount of material removed. Employing thismodel, inverse problems are then constructed where combinations of the abrasive particle size, the particle size distribution, the flow velocity, etc., are sought to maximize the efficiency of the process. A genetic algorithm is used to treat this inverse problem, and numerical...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/602066ws</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Arbelaez, D</name>
      </author>
      <author>
        <name>Zohdi, T I</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Trajectory generationinhigh-speed,high-precisionmicromillingusing subdivision curves</title>
      <link>https://escholarship.org/uc/item/50j5r9b3</link>
      <description>&lt;p&gt;Motion control in high-speed micromilling processes requires fast, accurate following of a specified curvilinear path. The accuracy with which the path can be followed is determined by the speed at which individual trajectories can be generated and sent to the control system. The time required to generate the trajectory is dependent on the representations used for the curvilinear trajectory path. In this study, we introduce the use of subdivision curves as a method for generating high-speed micromilling trajectories. Subdivision curves are discretized curves which are specified as a series of recursive refinements of a coarse mesh. By applying these recursive properties, machining trajectories can be computed very efficiently. Using a set of representative test curves, we show that with subdivision curves, trajectories can be generated significantly faster than with NURBS curves, which is the most common method currently used in generating high-speed machining trajectories....</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/50j5r9b3</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Vijayaraghavan, Athulan</name>
      </author>
      <author>
        <name>Sodemann, Angela</name>
      </author>
      <author>
        <name>Hoover, Aaron</name>
      </author>
      <author>
        <name>Mayor, J.Rhett</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Advanced monitoring of machining operations</title>
      <link>https://escholarship.org/uc/item/4h56k1ch</link>
      <description>&lt;p&gt;CIRP has had a long history of research and publication on the development and implementation of sensor monitoring of machining operations including tool condition monitoring, unmanned machining, process control and, more recently, advanced topics in machining monitoring, innovative signal processing, sensor fusion and related applications. This keynote follows a recent update of the literature on tool condition monitoring and documents the work of the cutting scientific technical committee in CIRP. The paper reviews the past contributions of CIRP in these areas and provides an up-to-date comprehensive survey of sensor technologies, signal processing, and decision making strategies for process monitoring. Application examples to industrial processes including reconfigurable sensor systems are reported. Future challenges and trends in sensor based machining operation monitoring are presented.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/4h56k1ch</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Teti, Roberto</name>
      </author>
      <author>
        <name>Jemielniak, Krzysztof</name>
      </author>
      <author>
        <name>O'Donnell, Garret</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing</title>
      <link>https://escholarship.org/uc/item/40n7p86w</link>
      <description>&lt;p&gt;The material removal characteristics of a silicon wafer were experimentally investigated with respect to the chemical dissolution and mechanical abrasion of the wafer during silicon chemical mechanical polishing (CMP) using an alkali-based slurry. The silicon surface without native oxide is rapidly dissolved by the slurry containing an amine agent, which effectively leads to the reduced hardness of the loaded silicon wafer due to Si–Si bond breaking during polishing. The abrasive particles in the slurry easily remove the reacted silicon surface, and the removal rate and wafer non-uniformity for abrasive concentrations of 1.5–3 wt% are better than those for other concentrations because of the low and steady coefficient of friction (COF) owing to the evenness of abrasive particles between the wafer and pad. Also, it was found that a high slurry flow rate of 700–1000cm3/min improves wafer non-uniformity owing to the reduced temporal variation of temperature, because the slurry...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/40n7p86w</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Park, Boumyoung</name>
      </author>
      <author>
        <name>Lee, Hyunseop</name>
      </author>
      <author>
        <name>Jeong, Haedo</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Research on Subwavelength Microphtonic Sensors for In-situ Monitoring with High Spatial and Temporal Resolution in Manufacturing Environments</title>
      <link>https://escholarship.org/uc/item/3z27c7gh</link>
      <description>&lt;p&gt;Micron-sized subwavelength structured photonic sensors could allow critical thermo-mechanical phenomena in manufacturing processes to be monitored, while offering tremendous advantages. To implement these novel sensors into real manufacturing processes, the microring sensors can be embedded at critical locations in metallic structures, which are heavily used in hostile manufacturing environments. This paper presents our research progress on fabrication, embedding, and application of integrated mciroring sensors. For fundamental study, microring resonators have been microfabricated on-chip with silicon-on-insulator wafer substrates. The fabricated optical resonators offer Qs on the order of 20,000, enabling significantly improved temporal sensing and detection of high-frequency strain variation. A new approach to fabricate metal embedded photonic structures was developed. Various thin film photonic materials were studied for embedded microphotonic sensors. Effect of process...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/3z27c7gh</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Li, Xiaochun</name>
      </author>
      <author>
        <name>Wong, Chee Wei</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Thomas, Brian</name>
      </author>
    </item>
    <item>
      <title>On impinging near-field granular jets</title>
      <link>https://escholarship.org/uc/item/2fs8q35q</link>
      <description>&lt;p&gt;In this work a multibody collision model, amenable to large-scale computation, is developed to simulate a jet of near-field grains impinging on a surface. This model is developed by computing momentum exchange for grain–grain and grain–surface interactions. The grain–grain interactions consist of collisions as well as near-field interactions. The analysis of these flows is separated into three components: (1) volume averaged quantities; (2) average surface tractions; and (3) average outflow conditions. For the surface stress calculations, parametric studies are performed on the properties of the surface and the grains through their coefficients of restitution, the strength of the near-field interactions, and the angle of attack of the jet. For the outflow calculations the flux of momentum through the simulation space is performed for varying near-field forces between the grains and varying degrees of surface roughness.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/2fs8q35q</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Arbelaez, D</name>
      </author>
      <author>
        <name>Zohdi, T I</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>The influence of cutting edge sharpness on surface finish in facing with round nosed cutting tools</title>
      <link>https://escholarship.org/uc/item/1sp832mw</link>
      <description>&lt;p&gt;The range of and particularly the minimumsurface roughnesses achievable mainly with cemented carbide but also with single crystal diamond round nosed turning and facing inserts has been experimentally studied, machining aluminium and steel on engineering and precision lathes. Characteristic variations of machined surface profile with feed rate as well as insert edge sharpness and roughness measurements are reported. For aluminium faced by carbide inserts on precision lathes, insert edge radius (re) rather than feed marks determined Rz at low feeds, with Rz 0.02re. For steel work material, its properties rather than the insert edge radius became the Rz determining factor.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/1sp832mw</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Childs, THC</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Sekiya, Katsuhiko</name>
      </author>
      <author>
        <name>Tezuka, Ryo</name>
      </author>
      <author>
        <name>Yamane, Yasuo</name>
      </author>
    </item>
    <item>
      <title>Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents</title>
      <link>https://escholarship.org/uc/item/12q6g963</link>
      <description>&lt;p&gt;During copper CMP, abrasives and asperities interact with the copper at the nano-scale, partially removing protective films. The local Cu oxidation rate increases, then decays with time as the protective film reforms. In order to estimate the copper removal rate and other Cu-CMP output parameters with a mechanistic model, the passivation kinetics of Cu, i.e. the decay of the oxidation current with time after an abrasive/copper interaction, are needed. For the first time in studying Cu-CMP, microelectrodes were used to reduce interference from capacitive charging, IR drops and low diffusion limited currents, problems typical with traditional macroelectrodes. Electrochemical impedance spectroscopy (EIS) was used to obtain the equivalent circuit elements associated with different electrochemical phenomena (capacitive, kinetics, diffusion etc.) at different polarization potentials. These circuit elements were used to interpret potential-step chronoamperometry results in inhibiting...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/12q6g963</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Tripathi, Shantanu</name>
      </author>
      <author>
        <name>Doyle, F M</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4</title>
      <link>https://escholarship.org/uc/item/0pn4r425</link>
      <description>&lt;p&gt;Millisecond scale benzotriazole (BTA) adsorption kinetics in acidic aqueous solution containing 0.01  M glycine and 0.01  M BTA have been investigated. Chronoamperometry was used to measure current densities on the surface of a micro-copper electrode in pH 4 aqueous solutions containing 0.01  M glycine with or without 0.01  M BTA. In the presence of BTA the current density decreased as the inverse of the square root of time for a few seconds due to adsorption of BTA. At potentials above 0.4  V saturated calomel electrode the current leveled off after a second or so due to the formation of a Cu(I)BTA monolayer on the copper surface. Based on these data a governing equation was constructed and solved to determine the initial kinetics of BTA adsorption. Analysis shows that material removal during copper chemical mechanical planarization (CMP) in this slurry chemistry occurs mostly by direct dissolution of copper species into the aqueous solution rather than mechanical removal...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/0pn4r425</guid>
      <pubDate>Wed, 19 Jan 2011 00:00:00 +0000</pubDate>
      <author>
        <name>Choi, Seungchoun</name>
      </author>
      <author>
        <name>Tripathi, Shantanu</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Doyle, F M</name>
      </author>
    </item>
    <item>
      <title>Integrated Tribo-Chemical Modeling of Copper CMP</title>
      <link>https://escholarship.org/uc/item/9966p85j</link>
      <description>&lt;p&gt;Copper CMP is a corrosion-wear process, in which mechanical and chemical-electrochemical phenomena interact synergistically. Existing models generally treat copper CMP as a corrosion enhanced wear process. However, the underlying mechanisms suggest that copper CMP would be better modeled as a wear enhanced corrosion process, where intermittent asperity/abrasive action enhances the local oxidation rate, and is followed by time-dependent passivation of copper. In this work an integrated tribo-chemical model of material removal at the asperity/ abrasive scale was developed. Abrasive and pad properties, process parameters, and slurry chemistry are all considered. Three important components of this model are the passivation kinetics of copper in CMP slurry chemicals; the mechanical response of protective films on copper; and the interaction frequency of copper with abrasives/pad asperities. The material removal rate during copper CMP was simulated using the tribo-chemical model,...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/9966p85j</guid>
      <pubDate>Thu, 29 Apr 2010 00:00:00 +0000</pubDate>
      <author>
        <name>Shantanu Tripathi</name>
      </author>
      <author>
        <name>Choi, Seungchoun</name>
      </author>
      <author>
        <name>Doyle, Fiona M</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Opportunities and Challenges to Sustainable Manufacturing and CMP</title>
      <link>https://escholarship.org/uc/item/6vn2918m</link>
      <description>&lt;p&gt;Today the requirements for reducing the impact of our manufacturing activities are increasing as the world awakes to and addresses the environmental impacts of our society. Energy consumption, greenhouse gas emissions, materials availability and use, environmental impact levels, etc. are all topics of interest. Semiconductor manufacturing in general and process steps such as CMP are not exempt from this and, in many cases, the industry has led the efforts in reducing impacts. This paper will first review some of the drivers for sustainable manufacturing, then define some of the terms that will be useful for determining the engineering aspects of sustainability and sustainable manufacturing, as well as metrics for assessing the impact of manufacturing in general and CMP in particular. An assessments of CMP will be given to illustrate the potential for “design for the environment” in CMP and related processes. Consideration will be given to research opportunities, including process...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/6vn2918m</guid>
      <pubDate>Thu, 29 Apr 2010 00:00:00 +0000</pubDate>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>CMP Modeling as a part of Design for Manufacturing</title>
      <link>https://escholarship.org/uc/item/4tr859cp</link>
      <description>&lt;p&gt;CMP faces numerous challenges, as we move towards 45-nm and 32-nm nodes. The most important of these, as identified by ITRS [1], are: a) reliably predicting and controlling post-CMP topography (dishing and erosion loss should be limited to within 10% of the interconnect height throughout the die); b) Integration of ultra low-K dielectric materials, including predicting stresses and damage, and designing very low stress polishing processes; and c) designing new planarization processes for new materials and new requirements.  To address these, a multi-scale (feature/die/wafer) CMP modeling framework is being developed for enabling Design for Manufacturing (DfM) and Manufacturing for Design (MfD). Topographic evolution has been studied for Shallow Trench Isolation CMP and is now being extended to copper CMP. A detailed, quantitative understanding of the mechanism(s) of CMP is being elucidated, using fundamental experiments and a mechanistic model based on physical data. Stress...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/4tr859cp</guid>
      <pubDate>Thu, 29 Apr 2010 00:00:00 +0000</pubDate>
      <author>
        <name>Shantanu Tripathi</name>
      </author>
      <author>
        <name>Adrien Monvoisin</name>
      </author>
      <author>
        <name>Fiona Doyle</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Variation in Machinability of Single Crystal Materials in Micromachining</title>
      <link>https://escholarship.org/uc/item/26h4f034</link>
      <description>&lt;p&gt;For practical application of micromechanical machining, four levels of process realization are required;  fundamental understanding of process physics, development of microplanning (processing parameter  optimization), macroplanning (tool path planning), and design optimization. This study surveyed the influence  of localized variation in the microstructure on final process outcome and machinability of brittle optical  material in a ductile regime. A clear correlation between burr height, critical depth of cut and crystallographic  orientation was found on single crystal materials (copper and magnesium fluoride), giving insight into optimal  orientations and process parameters for acceptable micromachining process outcome.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/26h4f034</guid>
      <pubDate>Tue, 14 Aug 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Inasaki, I</name>
      </author>
      <author>
        <name>Ohmori, H.</name>
      </author>
      <author>
        <name>Lee, D.</name>
      </author>
      <author>
        <name>Deichmueller, Manuel</name>
      </author>
      <author>
        <name>Yasuda, T.</name>
      </author>
      <author>
        <name>Niwa, K.</name>
      </author>
    </item>
    <item>
      <title>Tribo-Chemical Modeling of Copper CMP</title>
      <link>https://escholarship.org/uc/item/8v6445zj</link>
      <description>&lt;p&gt;We are developing an integrated tribo-chemical model of copper CMP that considers abrasive  and pad properties, process parameters (speed, pressure etc.), and slurry chemistry to predict  material removal rates. In this paper, the framework of the model is explained, and two  important constituents of the model are presented: transient passivation behavior and  characteristics of mechanical interactions.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/8v6445zj</guid>
      <pubDate>Wed, 27 Jun 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Tripathi, Shantanu</name>
      </author>
      <author>
        <name>Doyle, Fiona</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Application of AE Contact Sensing in Reliable Grinding Monitoring</title>
      <link>https://escholarship.org/uc/item/8kb028c3</link>
      <description>&lt;p&gt;The low repeatability of the AE RMS level and its weak correlation with some grinding quantities has been the  main problem that limits the use of this sensing technique in industrial environments. This paper presents  results on the influence of some measuring conditions on the AE information. Some reliable grinding  monitoring functions are proposed for production based on fast RMS analysis and binary contact detection  techniques. An innovative grit mapping technique is introduced based on these new concepts. Some  examples of application that include information about the topographic characteristics of a grinding wheel and  its transformation during grinding are presented.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/8kb028c3</guid>
      <pubDate>Wed, 27 Jun 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Gomes de Oliveira, J. F</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Chip Scale Prediction of Nitride Erosion in High Selectivity STI CMP</title>
      <link>https://escholarship.org/uc/item/3wk862xb</link>
      <description>&lt;p&gt;CMP has been successfully used for shallow trench isolation (STI) process in front end semiconductor  processing. In STI process, nitride covers active device area acting as the CMP stop layer. Amount of  nitride erosion during CMP is directly related to the step height of oxide isolation structure after removing  nitride, and affects device performance as well.  As semiconductor technology node is decreasing beyond  90nm, variation of nitride erosion over a chip in CMP process should be controlled within tight  specifications. A model based simulation tool for chip scale variation of nitride erosion would improve  not only CMP compatible STI layout design but also help in optimization of high density plasma  chemical vapor deposition (HDPCVD) process of oxide layer.   In this paper, a chip scale modeling scheme for better prediction of nitride erosion map  integrating HDPCVD oxide topography is presented. In addition, a simulation result for a specially  designed test pattern...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/3wk862xb</guid>
      <pubDate>Wed, 27 Jun 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Choi, Jihong</name>
      </author>
      <author>
        <name>Tripathi, Shantanu</name>
      </author>
      <author>
        <name>Hansen, David A</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Graphical Mapping of AE for Pad Condition Monitoring in Copper CMP</title>
      <link>https://escholarship.org/uc/item/12g571p1</link>
      <description>&lt;p&gt;Chemical mechanical planarization (CMP) of Cu interconnects is a critical bottleneck technology for semiconductor manufacturing at the 65 nm technology node and beyond.  The pad condition in CMP is of utmost importance in maintaining acceptable production quality and throughput, as it directly affects many different parameters in CMP including material removal rate (MRR) and process uniformity. Acoustic emission (AE) is a proven technique for in-situ monitoring of a wide range of manufacturing processes, and has been demonstrated for the in-situ monitoring of various phenomena in the CMP process such as endpoint and MRR detection.  A novel graphical mapping approach of sensor signal for monitoring pad condition during Cu CMP is proposed and tested, with AE demonstrating improved sensitivity over that of friction force.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/12g571p1</guid>
      <pubDate>Wed, 2 May 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Lee, D. E.</name>
      </author>
      <author>
        <name>Choi, Jihong</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Kim, H. J.</name>
      </author>
    </item>
    <item>
      <title>Chip Scale Topography Evolution Model for CMP Process Optimization</title>
      <link>https://escholarship.org/uc/item/97z7428c</link>
      <description>&lt;p&gt;A new chip scale model integrating pad height  distribution and it’s interaction with topography on a  patterned wafer was tested. Pad asperity height  distribution was used to calculate mean contact pressure  at a single asperity contact region. Material removal by a  single asperity was evaluated from Hertzian elastic  contact model and abrasive indentation model.   Simulation on a test pattern predicted relatively higher  removal rate and lower planarization efficiency with  higher nominal down pressure. Oxide thickness variation  over a test chip for a time period measured from specially  designed test structure matched well with the model  prediction.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/97z7428c</guid>
      <pubDate>Mon, 9 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Choi, Jihong</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Conditioning Effect on Pad Surface Height Distribution in Copper CMP</title>
      <link>https://escholarship.org/uc/item/19s438ph</link>
      <description>&lt;p&gt;In this study, surface topographies of different pad samples from varying in-situ conditioning  processes and differing pad life stages have been measured by white light interferometer. Copper removal  rate and within wafer non-uniformity was monitored during pad degradation test. Pad surface height  distribution, measured from white light interferometer, was more dependent on the plastic deformation  and wear at the retaining ring and wafer contact region than on in-situ conditioning. Also, the overall  removal rate in copper CMP was more dependent on the slurry flow than on pad surface height  distribution.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/19s438ph</guid>
      <pubDate>Mon, 9 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Choi, Jihong</name>
      </author>
      <author>
        <name>Wang, Z.</name>
      </author>
      <author>
        <name>Shen, W.</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Hsu, W.</name>
      </author>
    </item>
    <item>
      <title>Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues</title>
      <link>https://escholarship.org/uc/item/58r5204t</link>
      <description>&lt;p&gt;In this paper, three different sensors were used to measure multi-scale phenomena in chemical mechanical  planarization. A piezoelectric force sensor, Hall effect sensor and acoustic emission sensor (AE) were  installed in CMP equipment and the signals were measured simultaneously during the polishing process. The  results showed that the sensors measuring frictional behaviour, such as the Hall effect sensor and force  transducer, produced a clear end point signal in the case of the friction characteristics are distinguishable for  each material. Also, if there is difference in hardness between materials, then a sharp end point signal is  detected with the AE sensor even though the friction characteristic is similar between the two materials.  Therefore, using multi-sensors having different bandwidths is complementary for not only process monitoring  but also end point detection.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/58r5204t</guid>
      <pubDate>Fri, 6 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Jeong, H.</name>
      </author>
      <author>
        <name>Kim, H.</name>
      </author>
      <author>
        <name>Lee, Sunghoon</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 1</title>
      <link>https://escholarship.org/uc/item/0n2575s1</link>
      <description>&lt;p&gt;A material removal rate (MRR) model as a function of  abrasive weight concentration has been proposed by extending a material  removal model developed earlier [1-2]. With an increase of the weight  concentration of abrasives/MRR, three regions of material removal exist:  first, a chemically dominant and rapid increasing region, whose range is  determined by the generation/passivation rate and hardness of the surface  passivation layer, second, a mechanically dominant linear region, where  the material removal is proportional to the weight concentration, and third,  a mechanical dominant saturation region, where the material removal  saturates because the total contact area is fully occupied by the abrasives.  The passive layer of the wafer surface is proposed to be a bi-layer  structure. In the first part of this paper, a detailed model is proposed to  explain that the transition from the first to the second region is due to a  transition from a wafer surface covered with a...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/0n2575s1</guid>
      <pubDate>Fri, 6 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Luo, Jianfeng</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization</title>
      <link>https://escholarship.org/uc/item/9nh338zg</link>
      <description>&lt;p&gt;The ability to predict material removal rates in chemical mechanical planarization (CMP) is an essential  ingredient for low cost, high quality IC chips. Recently, models that address the slurry particles have been  proposed. We address three such models. The first two differ only in how the number of active particles is  computed. Both assume that pad asperities are identical and nonrandom. The third is dynamic in  accommodating changing pad properties. For larger mean particle size (diameter), the role of the standard  deviation of particle size distribution is uncertain. The dynamic behavior of the third model is compared with  experimental observations.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/9nh338zg</guid>
      <pubDate>Thu, 5 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Wang, C</name>
      </author>
      <author>
        <name>Chandra, A.</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Recent Advances in Mechanical Micromachining</title>
      <link>https://escholarship.org/uc/item/8rf718jm</link>
      <description>&lt;p&gt;This paper reviews some of the main drivers, developments and future requirements in the field of  micromanufacturing as related to the machining process from the perspective of the recent research and  development literature. For the purposes of this paper micromachining includes creation of precise two and  three dimensional workpieces with dimensions in the range of a few tens of nanometers to some few  millimeters by cutting using defined geometry cutting tools. The review includes topics of process physics,  including materials and microstructural effects, machine tools, tooling and sensing, workpiece and design  issues, software and simulation tools, and other issues, e.g. surface and edge finish, and outlook for future  developments.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/8rf718jm</guid>
      <pubDate>Thu, 5 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Takeuchi, Y.</name>
      </author>
    </item>
    <item>
      <title>Material Removal Mechanisms in Lapping and Polishing</title>
      <link>https://escholarship.org/uc/item/4hw2r7qc</link>
      <description>&lt;p&gt;Polishing processes are critical to high value production processes such as IC manufacturing. The  fundamental material removal mechanisms, howeve, are poorly understood. Technological outputs (e.g.,   surface finish, sub-surface damage, part shape) and throughput of lapping and polishing processes are  affected by a large number of variables. Individual processes are well controlled within individual enterprises,  yet there appears to be little ability to predict process performance a priori. As a first step toward improving  process modeling, this paper reviews the fundamental mechanisms of material removal in lapping and  polishing processes and identifies key areas where further work is required.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/4hw2r7qc</guid>
      <pubDate>Thu, 5 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Evans, C. J.</name>
      </author>
      <author>
        <name>Paul, E.</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Lucca, D. A.</name>
      </author>
      <author>
        <name>Byrne, G.</name>
      </author>
      <author>
        <name>Tricard, M.</name>
      </author>
      <author>
        <name>Klocke, F.</name>
      </author>
      <author>
        <name>Dambon, O.</name>
      </author>
      <author>
        <name>Mullany, B. A.</name>
      </author>
    </item>
    <item>
      <title>Precision Manufacturing Process Monitoring With Acoustic Emission</title>
      <link>https://escholarship.org/uc/item/5tp0299m</link>
      <description>&lt;p&gt;Current demands in high-technology industries such as semiconductor, optics, MEMS, etc. have predicated the need for manufacturing  processes that can fabricate increasingly smaller features reliably at very high tolerances. In situ monitoring systems that can be used to  characterize, control, and improve the fabrication of these smaller features are therefore needed to meet increasing demands in precision and  quality. This paper discusses the unique requirements of monitoring of precision manufacturing processes, and the suitability of acoustic  emission (AE) as a monitoring technique at the precision scale. Details are then given on the use of AE sensor technology in the monitoring of  precision manufacturing processes; grinding, chemical–mechanical planarization (CMP) and ultraprecision diamond turning in particular.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/5tp0299m</guid>
      <pubDate>Wed, 4 Apr 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Lee, D.E.</name>
      </author>
      <author>
        <name>Huang, Inkil</name>
      </author>
      <author>
        <name>Valente, Carlos M. O.</name>
      </author>
      <author>
        <name>Oliveira, J. F.</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Scalability of Tool Path Planning to Micro Machining</title>
      <link>https://escholarship.org/uc/item/1m1132dv</link>
      <description>&lt;p&gt;Micromachining applications have received increased emphasis in recent years with the advent of new precision  manufacturing applications which have stringent requirements for surface and edge finish. One of the main concerns in mi-  cromachining is burr formation which can incur high production costs due to time-consuming deburring operations. Although  deburring operations are commonly carried out in macroscale milling, in micro machining they can be difficult to use. De-  burring processes can destroy delicate microfeatures and are usually unfeasible at the micro scale. For this reason, the utiliza-  tion of burr minimizing machining tool paths is desirable. Optimum tool paths minimize burr formation while satisfying sur-  face quality requirements, dimensional tolerances, and cycle time constraints. A new concept for micro end milling tool paths  is developed. An integrated performance index using the Taguchi method is introduced to optimize the main microscale end  milling...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/1m1132dv</guid>
      <pubDate>Wed, 14 Feb 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Litwinski, Kai M</name>
      </author>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Lee, Dae-Eun</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Lee, Nakkyu</name>
      </author>
    </item>
    <item>
      <title>Surface and Edge Quality Variation in Precision Machining of Single Crystal and Polycrystalline Materials</title>
      <link>https://escholarship.org/uc/item/9sf8f60d</link>
      <description>&lt;p&gt;The surface and edge quality of single-crystal and polycrystalline copper workpieces has been observed to vary significantly as a function of crystallographic orientation. On the precision scale, the chip formation process is influenced by the microstructure of the material, such as grain boundaries and grain orientation in polycrystalline materials, and crystallographic orientation in single-crystal materials. Such variation in the microstructure has a significant effect on the resulting surface, edge, and burr topography.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/9sf8f60d</guid>
      <pubDate>Wed, 7 Feb 2007 00:00:00 +0000</pubDate>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Lee, D.E.</name>
      </author>
      <author>
        <name>de  Grave, A.</name>
      </author>
      <author>
        <name>Valente, Carlos M. O.</name>
      </author>
      <author>
        <name>Lin, J.</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Variation in Machinability of Single Crystal Materials in Micromechanical Machining</title>
      <link>https://escholarship.org/uc/item/6991f42f</link>
      <description>&lt;p&gt;With increasing demands in manufacturing for smaller and more precise features, the advent of micromechanical machining processes, such as microdrilling and micromilling to create features at the microscale are of increasing importance. However, at the length scales found in micromechanical machining, localized variation in the microstructure (such as grain boundaries and grain orientation in polycrystalline materials) can greatly affect the machinability and final process outcome in terms of surface and edge condition; defects such as excessive roughness and burrs are of particular importance. A focused set of micromachining experiments were conducted on single crystal materials in order to further understand how surface and edge condition are affected by material crystallographic orientation. A clear correlation between burr height and crystallographic orientation was found, giving insight into optimal orientations and process parameters for acceptable micromachining process...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/6991f42f</guid>
      <pubDate>Sun, 18 Jun 2006 00:00:00 +0000</pubDate>
      <author>
        <name>Lee, Dae-Eun</name>
      </author>
      <author>
        <name>Min, Sangkee</name>
      </author>
      <author>
        <name>Deichmueller, Manuel</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>Bicepstrum Based Blind Identification of the Acoustic Emission</title>
      <link>https://escholarship.org/uc/item/2np9393g</link>
      <description>&lt;p&gt;It is believed that the Acoustic Emissions (AE) signal contains potentially valuable information for monitoring precision cutting processes, as well as to be employed as a control feedback signal. However, AE stress waves produced in the cutting zone are distorted by the transmission path and the measurement systems. In this article, a bicepstrum based blind deconvolution technique is proposed as a valid tool for estimating both, transmission path and sensor impulse response. Assumptions under which application of bicepstrum is valid are discussed and diamond turning experiments are presented, which demonstrate the feasibility of employing bicepstrum for AE blind deconvolution.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/2np9393g</guid>
      <pubDate>Fri, 16 Jun 2006 00:00:00 +0000</pubDate>
      <author>
        <name>Iturrospe, Aitzol</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
      <author>
        <name>Atxa, Vicente</name>
      </author>
      <author>
        <name>Abete, Jose Manuel</name>
      </author>
    </item>
    <item>
      <title>In-Situ Acoustic Emission Monitoring of Surface Chemical Reactions for Copper CMP</title>
      <link>https://escholarship.org/uc/item/7bd8p475</link>
      <description>&lt;p&gt;Acoustic emission (AE) is used as a technique to monitor and characterize surface interactions between wafer and pad in a chemical-mechanical planarization (CMP) process for copper.  A significant variation in in-situ AE signal was observed during controlled variation of the slurry composition, demonstrating the sensitivity of AE to the unique surface reactions taking place.  Two different levels of AE were observed; a high root-mean-square (RMS) signal when polishing H2O2 treated copper, and a low RMS signal when polishing bare copper.  The rate of change in the AE signal was also tied to variations in species concentration and pH in slurry.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/7bd8p475</guid>
      <pubDate>Wed, 20 Jul 2005 00:00:00 +0000</pubDate>
      <author>
        <name>Lee, D. E.</name>
      </author>
      <author>
        <name>Choi, Jihong</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Technological Approaches in Nanopolishing for Microstructures</title>
      <link>https://escholarship.org/uc/item/6th614qz</link>
      <description>&lt;p&gt;Polishing technology has been broadly used in manufacturing of components to enhance the surface quality at final processing stage. On the threshold for the 21th century, all of technologies are changing more rapidly than the past. One of them is the miniaturization of the smart systems that require new technological approaches in manufacturing processes. Scientists and engineers have some responsibilities to revise the terminology and expand the area of each technology from the conventional one to nanoengineering. This paper focuses on the introduction of new technological approaches in nanopolishing for microstructures that imply new additional concepts on the conventional polishing. New concepts include damage-free, planarization, nanotopography and conformalization. Damage-free means to get not only atomic level surface roughness, but also subsurface without any physical defects. As one of the emerging methods, chemical mechanical polishing (CMP) is introduced with chemical...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/6th614qz</guid>
      <pubDate>Mon, 31 May 2004 00:00:00 +0000</pubDate>
      <author>
        <name>Jeong, Haedo</name>
      </author>
      <author>
        <name>Kim, Hyoungjae</name>
      </author>
      <author>
        <name>Lee, Sunghoon</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Pad Contact Area Characterization in  Chemical Mechanical Planarization</title>
      <link>https://escholarship.org/uc/item/326856vn</link>
      <description>&lt;p&gt;There are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these, the pad is considered as one of the most important parts because of its deterioration during polishing. However, a special purpose pad design has not been tried yet. In this paper, a fabrication process and prototype are detailed using micro molding technology. These are applied to pad design optimization pressure.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/326856vn</guid>
      <pubDate>Mon, 31 May 2004 00:00:00 +0000</pubDate>
      <author>
        <name>Lee, Sunghoon</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Modeling of Pressure Non-Uniformity at a Die Scale For ILD CMP</title>
      <link>https://escholarship.org/uc/item/0dq919t9</link>
      <description>&lt;p&gt;Local material removal rate is inversely proportional to the local pattern density in ILDCMP. With the assumption that the local velocity and Preston coefficient are constant across a die, local MRR non-uniformity is attributed to the local pressure non-uniformity. Pressure distributions on two different test patterns consisting of five different pattern density sections were calculated with a finite element model. These pressure distributions were compared with semi-empirical pattern dependant oxide CMP model with three different weighting functions. Results showed that pressure distribution can be well approximated with the pattern density dependant oxide CMP model.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/0dq919t9</guid>
      <pubDate>Mon, 31 May 2004 00:00:00 +0000</pubDate>
      <author>
        <name>Choi, Jihong</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Evaluation of the Effect of Pad Thickness and Stiffness on Pressure Non-Uniformity at Die-Scale in ILD CMP</title>
      <link>https://escholarship.org/uc/item/06k6x1vm</link>
      <description>&lt;p&gt;In this study, 2^4  full factorial design of experiment was applied to an FEM model, which gives pattern dependant contact pressure distribution, to build a qualitative model of pad effects on within die non-uniformity (WIDNU) in CMP. Analysis of variance showed that every single effect and two-way interaction effects of hard layer stiffness and soft layer stiffness are significant compared to the round-off error from mesh change. Various regression models were built and residual analyses were done for each of them. Best model with best normality of residuals includes only the effect of hard layer stiffness, soft layer stiffness and hard layer thickness.  Based on this model, basic qualitative design rule for a stacked CMP pad to minimize WIDNU were suggested.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/06k6x1vm</guid>
      <pubDate>Mon, 31 May 2004 00:00:00 +0000</pubDate>
      <author>
        <name>Choi, Jihong</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Micromilling for Mold Fabrication</title>
      <link>https://escholarship.org/uc/item/8bw9x781</link>
      <description>&lt;p&gt;A method for manufacturing a new type of CMP pad is presented. The goal is to create a mold containing micro sized features that can be used in vacuum casting to produce the polymeric polishing pads. To  achieve this, a positive mold is cut from PMMA using micro milling techniques.  An opposite mold is then created by electroplating nickel onto the mold and separating the metal from the polymer.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/8bw9x781</guid>
      <pubDate>Thu, 14 Aug 2003 00:00:00 +0000</pubDate>
      <author>
        <name>Keppeler, Chrisian R</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>MEMS Applications of CMP</title>
      <link>https://escholarship.org/uc/item/76x709kc</link>
      <description>&lt;p&gt;In order to keep pace with tight designs for MEMS, CMP has started to be adopted. In this report, some MEMS devices fabricated with CMP are shown, and some possible areas in which CMP can make contribution  to are suggested.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/76x709kc</guid>
      <pubDate>Thu, 14 Aug 2003 00:00:00 +0000</pubDate>
      <author>
        <name>Hwang, Inkil</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Analysis of Tool and Workpiece Interaction in Diamond Turning using Graphical Analysis of Acoustic Emission</title>
      <link>https://escholarship.org/uc/item/5f00043r</link>
      <description>&lt;p&gt;The surface quality obtained in diamond  turning operations Is highly influenced by the interaction between the  tool and workpiece. These influences include changes in cutting forces, chip formation phenomena, microstructure of workpiece, and others. Local changes in the depth of cut and material properties lead to variable cutting forces that may result in unacceptable form errors. This research proposes an innovative approach for mapping the AE RMS generated during diamond turning able to graphically represent several features of the  interaction between tool and workpiece related to instant depth of cut distribution, grain boundaries, and grain orientation.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/5f00043r</guid>
      <pubDate>Thu, 14 Aug 2003 00:00:00 +0000</pubDate>
      <author>
        <name>Valente, Carlos M</name>
      </author>
      <author>
        <name>Dornfeld, David</name>
      </author>
    </item>
    <item>
      <title>A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype -</title>
      <link>https://escholarship.org/uc/item/4mz5893r</link>
      <description>&lt;p&gt;There are many elements affecting CMP performance such as  slurry, pad, process parameters and pad conditioning. Among these elements,  the pad is considered one of the most important because of its deterioration    during polishing. A special purpose pad design, however, has not been  tried yet. In this paper, a fabrication process and prototype are detailed using micro molding technology. These are applied to pad design optimization.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/4mz5893r</guid>
      <pubDate>Thu, 14 Aug 2003 00:00:00 +0000</pubDate>
      <author>
        <name>Lee, Sunghoon</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales</title>
      <link>https://escholarship.org/uc/item/4ct2n4jh</link>
      <description>&lt;p&gt;Modeling and simulation are critical to transfer CMP from  an engineering 'art' to an engineering 'science'. Research efforts in  CMP modeling have been attempted in the last decade. There is an urgent need to review the current models including their limitations and future research directions systematically. In this paper, chemical mechanical  planarization modeling is reviewed systematically, from particle scale  to die and wafer scales.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/4ct2n4jh</guid>
      <pubDate>Thu, 14 Aug 2003 00:00:00 +0000</pubDate>
      <author>
        <name>Luo, Jianfeng</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Wafer-Scale CMP Modeling of With-in Wafer Non-Uniformity</title>
      <link>https://escholarship.org/uc/item/29g1z2t6</link>
      <description>&lt;p&gt;In this report, the with-in wafer non-uniformity (WIWNU) of  material removal rate and its optimization are discussed from both the  machine side and consumable side. At the machine side, the pressure  and velocity distribution are the major reasons for the non-uniform  material removal rate across the wafer. The velocity distributions for the rotational type and linear type of machines are analyzed systematically. The rotational part of the velocity is the contributor of the velocity non-uniformity. The pressure non-uniformity in both cases of the solid-solid  contact and the solid-fluid-solid contact are discussed. Adding the retaining ring is an effective way to reduce the pressure non-uniformity  at the edge of the wafer in the solid-solid contact mode. In the solid-fluid-solid contact mode, the friction coefficient is identified as the major contributor  to the non-uniformity. A process window of pressure and velocity in  terms of small non-uniformity can be obtained by...</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/29g1z2t6</guid>
      <pubDate>Thu, 14 Aug 2003 00:00:00 +0000</pubDate>
      <author>
        <name>Luo, Jianfeng</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
    <item>
      <title>Design Rules for the Development of a New-Concept Pad</title>
      <link>https://escholarship.org/uc/item/1542q9pt</link>
      <description>&lt;p&gt;In order to address new concerns in the CMP process, a new-concept            pad with a composite structure and controlled geometries is proposed.&lt;/p&gt;</description>
      <guid isPermaLink="true">https://escholarship.org/uc/item/1542q9pt</guid>
      <pubDate>Thu, 14 Aug 2003 00:00:00 +0000</pubDate>
      <author>
        <name>Hwang, Inkil</name>
      </author>
      <author>
        <name>Dornfeld, David A</name>
      </author>
    </item>
  </channel>
</rss>
