We report results from beam tests on silicon microstrip detectors using a binary readout system for ATLAS. The data were collected during the H8 beam test at CERN in August/September 1995 and the KEK test in February 1996. The binary modules tested had been assembled from silicon microstrip detectors of different layout and from front-end electronics chips of different architecture. The efficiency, noise occupancy and position resolution were determined as a function of the threshold setting for various bias voltages and angles of incidence for both irradiated and non-irradiated detectors. In particular, the high spatial resolution of the beam telescope allowed the evaluation of the performance as a function of the track location in between detector strips.

The monitoring of the performance of silicon strip systems with binary readout is discussed. Due to the fact that neither pulse height nor noise level are recorded, the system is monitored with the efficiency and noise occupancy. As an example, on-line monitoring of the binary silicon strip system at the ATLAS H8 beam test at CERN is described.

We report on the results from a beam test of a binary silicon strip system proposed for ATLAS. The data were collected during the H8 beam test at CERN in 1995 and at a beam test at KEK in 1996. The binary modules tested had been assembled from silicon micro-strip detectors of different layout and from front-end electronics chips of different architecture. The efficiency, noise occupancy, and position resolution were determined as a function of the threshold setting for various bias voltages and angles of incidence. Interstrip effects were also evaluated using a high resolution telescope. The performance of a prototype detector module irradiated to a fluence of 1.2×1014p/cm2 is also characterized.

© 2020 CERN for the benefit of the ATLAS collaboration.. For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: An early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

Measurements of the total and differential cross sections of Higgs boson production are performed using 20.3  fb^{-1} of pp collisions produced by the Large Hadron Collider at a center-of-mass energy of sqrt[s]=8  TeV and recorded by the ATLAS detector. Cross sections are obtained from measured H→γγ and H→ZZ^{*}→4ℓ event yields, which are combined accounting for detector efficiencies, fiducial acceptances, and branching fractions. Differential cross sections are reported as a function of Higgs boson transverse momentum, Higgs boson rapidity, number of jets in the event, and transverse momentum of the leading jet. The total production cross section is determined to be σ_{pp→H}=33.0±5.3 (stat)±1.6 (syst)  pb. The measurements are compared to state-of-the-art predictions.