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Scholarly Works (4 results)
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Article
Peer Reviewed
Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration
Fukushima, Takafumi
;
Alam, Arsalan
;
Hanna, Amir
;
Jangam, Siva
;
Bajwa, Adeel
;
Iyer, Subramanian
UCLA Previously Published Works
(2018)
Article
Peer Reviewed
Heterogeneous Integration at Fine Pitch (<=10 μm) using Thermal Compression Bonding
Bajwa, Adeel A.
;
Jangam, SivaChandra
;
Pal, Saptadeep
;
Marathe, Niteesh
;
Bai, Tingyu
;
Fukushima, Takafumi
;
Goorsky, Mark
;
Iyer, Subramanian S.
UCLA Previously Published Works
(2017)
Article
Peer Reviewed
"FlexTrate^TM” - Scaled Heterogeneous Integrationon Flexible Biocompatible Substrates using FOWLP
Fukushima, Takafumi
;
Alam, Arsalan
;
Wan, Zhe
;
Jangam, SivaChandra
;
Pal, Saptadeep
;
Ezhilarasu, Goutham
;
Bajwa, Adeel
;
Iyer, Subramanian S.
UCLA Previously Published Works
(2017)
Article
Peer Reviewed
Extremely Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 μm) and Reliable Flexible Cu-based Interconnects
Hanna, Amir
;
Fukushima, Takafumi
;
Alam, Arsalan
;
Moran, Steven
;
Whitehead, William
;
Jangam, Siva
;
Irwin, Randall
;
Bajwa, Adeel
;
Pal, Saptadeep
;
Iyer, Subramanian
UCLA Previously Published Works
(2018)
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