The thermal performance of windows is important for energy efficient buildings. Windows typically account for about 30-50 percent of the transmission losses though the building envelope, even if their area fraction of the envelope is far less. The reason for this can be found by comparing the thermal transmittance (U-factor) of windows to the U-factor of their opaque counterparts (wall, roof and floor constructions). In well insulated buildings the U-factor of walls, roofs an floors can be between 0.1-0.2 W/(m2K). The best windows have U-values of about 0.7-1.0. It is therefore obvious that the U-factor of windows needs to be reduced, even though looking at the whole energy balance for windows (i.e. solar gains minus transmission losses) makes the picture more complex. In high performance windows the frame design and material use is of utmost importance, as the frame performance is usually the limiting factor for reducing the total window U-factor further. This paper describes simulation studies analyzing the effects on frame and edge-of-glass U-factors of different surface emissivities as well as frame material and spacer conductivities. The goal of this work is to define materials research targets for window frame components that will result in better frame thermal performance than is exhibited by the best products available on the market today.

Despite significant advancements in fenestration technology in the last two decades, the thermal transmittance of fenestration products is still significantly higher than that of walls. This corresponds to 60% of the total energy loss of a modern building envelope through the windows. Hence, further development and improvements of fenestration products are necessary. Increasingly stringent codes and standards for fenestration stimulate industry to work on improved solutions. Thus, it is crucial that assessment techniques are able to account for innovations accurately. The thermal effects of non-continuous hardware in window frames are currently ignored by international rating procedures. A preliminary investigation conducted by our team showed significant performance degradation in two of the three out-opening casement profiles caused by the presence of operating hardware. Frames with the structure made of vinyl and fiberglass consist of many air cavities that are penetrated by operating hardware made of highly conductive materials. In these frames, in order to have an accurate assessment, it may be required to employ three-dimensional modeling due to the convective nature of heat transfer within the cavities. However, in this study, we demonstrate that the three-dimensional (3D) effects of non-continuous hardware can be approximated accurately with simpler two-dimensional (2D) simulations. We then develop a simplified model based on weighted average capable of replacing the time-and computation-intensive 3D simulations with 2D simulations and validate it against market available frames and their corresponding hardware. Validation results show that our approximation technique results in discrepancies lower than 0.05 W/(m2K), or 3% of the total thermal transmittance. Thus, we conclude that simplified 2D simulation models may be used for predicting hardware impact in window frames with reasonable accuracy. As windows and glazing structures are becoming ever better thermally insulated, it is becoming even more important to be able to model the impact of the operating hardware on the total thermal performance in order to design the best windows possible and not let the operating hardware ruin an otherwise well-proven design, which is hence addressed in this study.