Droplet interactions with compliant materials are familiar, but surprisingly complex processes of importance to the manufacturing, chemical, and garment industries. Despite progress-previous research indicates that mesoscopic substrate deformations can enhance droplet drying or slow down spreading dynamics-our understanding of how the intertwined effects of transient wetting phenomena and substrate deformation affect drying remains incomplete. Here we show that above a critical receding contact line speed during drying, a previously not observed wetting transition occurs. We employ 4D confocal reference-free traction force microscopy (cTFM) to quantify the transient displacement and stress fields with the needed resolution, revealing high and asymmetric local substrate deformations leading to contact line pinning, illustrating a rate-dependent wettability on viscoelastic solids. Our study has significance for understanding the liquid removal mechanism on compliant substrates and for the associated surface design considerations. The developed methodology paves the way to study complex dynamic compliant substrate phenomena.