Alumina has been joined at 1400 degrees C using niobium-based interlayers. Two different joining approaches were compared: solid-state diffusion bonding using a niobium foil as an interlayer, and liquid-film assisted bonding using a multilayer copper/niobium/copper interlayer. In both cases, a 127-(mu)m thick niobium foil was used; =1.4-(mu)m or =3-(mu)m thick copper films flanked the niobium. Room-temperature four-point bend tests showed that the introduction of a copper film had a significant beneficial effect on the average strength and the strength distribution. Experiments using sapphire substrates indicated that during bonding the initially continuous copper film evolved into isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. Film breakup appeared to initiate at either niobium grain boundary ridges, or at asperities or irregularities on the niobium surface that caused localized contact with the sapphire.

High residual stresses are typical in additively manufactured metals and can reach levels as high as the yield strength, leading to distortions and even cracks. Here, an in situ method for controlling residual stress during laser powder bed fusion additive manufacturing was demonstrated. By illuminating the surface of a build with homogeneously intense, shaped light from a set of laser diodes, the thermal history was controlled thereby reducing the residual stress in as-built parts. 316L stainless steel bridge-shaped parts were built to characterize the effect of in situ annealing on the residual stress. A reduction in the overall residual stress value of up to 90% was realized without altering the as-built grain structure (no grain growth). Some annealing effects on the cellular-dendritic solidification structure (patterns of higher solute content)occurred in areas that experienced prolonged exposure to elevated temperature. A comparison of the in situ process to conventional post-build annealing demonstrated equivalent stress reduction compared to rule-of-thumb thermal treatments. Use of this method could reduce or remove the need for post processing to remove residual stresses.

Fabricating parts using laser powder bed fusion (LPBF) is of growing interest to many fields, ranging from medical to aerospace, but this process is often plagued with residual stresses that can reach magnitudes as high as the yield strength of the material. Previous work has demonstrated the ability to reduce residual stress during LPBF by over 90% using an in situ annealing method that makes use of large area, shaped light illumination from a set of laser diodes. In this work, an in-depth analysis of the effectiveness of this in situ residual stress reduction technique is presented. A custom LPBF system was used to fabricate 316L stainless steel parts, and the stresses of these parts were analyzed using the contour method and neutron diffraction on various planes within the samples. These spatial measurements revealed stress reductions near the edges and base of the samples in each of the three measured orthogonal stress directions, in addition to an overall reduction in stress owing to in situ application of laser diode heating. The experimental results were found to be in excellent agreement with numerical thermomechanical simulations that captured the effects of various processing parameters. Furthermore, in cases where the annealing was only performed once every 5 layers, the residual stress was similarly reduced, which indicates that further optimization might be achieved to limit additional processing time during the builds while still relieving equivalent amounts of stress.