Since the advent of impact ionization and its application in avalanche photodiodes (APD), numerous application goals have contributed to steady improvements over several decades. The characteristic high operating voltages and the need for thick absorber layers (π-layers) in the Si-APDs pose complicated design and operational challenges in complementary metal oxide semiconductor integration of APDs. In this work, we have designed a sub-10 V operable Si-APD and epitaxially grown the stack on a semiconductor-on-insulator substrate with a submicron thin π-layer, and we fabricated the devices with integrated photon-trapping microholes (PTMH) to enhance photon absorption. The fabricated APDs show a substantially low prebreakdown leakage current density of ∼50 nA/mm². The devices exhibit a consistent ∼8.0 V breakdown voltage with a multiplication gain of 296.2 under 850 nm illumination wavelength. We report a ∼5× increase in the EQE at 850 nm by introducing the PTMH into the device. The enhancement in the EQE is evenly distributed across the entire wavelength range (640-1100 nm). The EQE of the devices without PTMH (flat devices) undergo a notable oscillation caused by the resonance at specific wavelengths and show a strong dependency on the angle of incidence. This characteristic dependency is significantly circumvented by introducing the PTMH into the APD. The devices exhibit a significantly low off-state power consumption of 0.41 μW/mm² and stand fairly well against the state-of-the-art literature. Such high efficiency, low leakage, low breakdown voltage, and extremely low-power Si-APD can be easily incorporated into the existing CMOS foundry line and enable on-chip, high-speed, and low-photon count detection on a large scale.

The applications of hyperspectral imaging across disciplines such as healthcare, automobiles, forensics, and astronomy are constrained by the requirement for intricate filters and dispersion lenses. By utilization of devices with engineered spectral responses and advanced signal processing techniques, the spectral imaging process can be made more approachable across various fields. We propose a spectral response design method employing photon-trapping surface textures (PTSTs), which eliminates the necessity for external diffraction optics and facilitates system miniaturization. We have developed an analytical model to calculate electromagnetic wave coupling using the effective refractive index of silicon in the presence of PTST. We have extensively validated the model against simulations and experimental data, ensuring the accuracy of our predictions. We observe a strong linear relationship between the peak coupling wavelength and the PTST period along with a moderate proportional relation to the PTST diameters. Additionally, we identify a significant correlation between inter-PTST spacing and wave propagation modes. The experimental validation of the model is conducted using PTST-equipped photodiodes fabricated through complementary metal-oxide-semiconductor-compatible processes. Further, we demonstrate the electrical and optical performance of these PTST-equipped photodiodes to show high speed (response time: 27 ps), high gain (multiplication gain, M: 90), and a low operating voltage (breakdown voltage: ∼ 8.0 V). Last, we utilize the distinctive response of the fabricated PTST-equipped photodiode to simulate hyperspectral imaging, providing a proof of principle. These findings are crucial for the progression of on-chip integration of high-performance spectrometers, guaranteeing real-time data manipulation, and cost-effective production of hyperspectral imaging systems.

Avalanche and Single-Photon Avalanche photodetectors (APDs and SPADs) rely on the probability of photogenerated carriers to trigger a multiplication process. Photon penetration depth plays a vital role in this process. In silicon APDs, a significant fraction of the short visible wavelengths is absorbed close to the device surface that is typically highly doped to serve as a contact. Most of the photogenerated carriers in this region can be lost by recombination, get slowly transported by diffusion, or multiplied with high excess noise. On the other hand, the extended penetration depth of near-infrared wavelengths requires thick semiconductors for efficient absorption. This diminishes the speed of the devices due to the long transit time in the thick absorption layer that is required for detecting most of these photons. Here, we demonstrate that it is possible to drive photons to a critical depth in a semiconductor film to maximize their gain-bandwidth performance and increase the absorption efficiency. This approach to engineering the penetration depth for different wavelengths in silicon is enabled by integrating photon-trapping nanoholes on the device surface. The penetration depth of short wavelengths such as 450 nm is increased from 0.25 µm to more than 0.62 µm. On the other hand, for a long-wavelength like 850 nm, the penetration depth is reduced from 18.3 µm to only 2.3 µm, decreasing the device transit time considerably. Such capabilities allow increasing the gain in APDs by almost 400× at 450 nm and by almost 9× at 850 nm. This engineering of the penetration depth in APDs would enable device designs requiring higher gain-bandwidth in emerging technologies such as Fluorescence Lifetime Microscopy (FLIM), Time-of-Flight Positron Emission Tomography (TOF-PET), quantum communications systems, and 3D imaging systems.