The structure and growth of water films on surfaces is reviewed, starting from single molecules to two-dimensional wetting layers, and liquid interfaces. This progression follows the increase in temperature and vapor pressure from a few degrees Kelvin in ultra-high vacuum, where Scanning Tunneling and Atomic Force Microscopies (STM and AFM) provide crystallographic information at the molecular level, to ambient conditions where surface sensitive spectroscopic techniques provide electronic structure information. We show how single molecules bind to metal and non-metal surfaces, their diffusion and aggregation. We examine how water molecules can be manipulated by the STM tip via excitation of vibrational and electronic modes, which trigger molecular diffusion and dissociation. We review also the adsorption and structure of water on non-metal substrates including mica, alkali halides, and others under ambient humid conditions. We finally discuss recent progress in the exploration of the molecular level structure of solid-liquid interfaces, which impact our fundamental understanding of corrosion and electrochemical processes.

The variation in the morphology and electronic structure of copper during the electroreduction of CO₂ into valuable hydrocarbons and alcohols was revealed by combining in situ surface- and bulk-sensitive X-ray spectroscopies with electrochemical scanning electron microscopy. These experiments proved that the electrified interface surface and near-surface are dominated by reduced copper. The selectivity to the formation of the key C-C bond is enhanced at higher cathodic potentials as a consequence of increased copper metallicity. In addition, the reduction of the copper oxide electrode and oxygen loss in the lattice reconstructs the electrode to yield a rougher surface with more uncoordinated sites, which controls the dissociation barrier of water and CO₂. Thus, according to these results, copper oxide species can only be stabilized kinetically under CO₂ reduction reaction conditions.