Heterogeneous integration of InGaAsP microdisk lasers on a silicon platform is demonstrated experimentally using an optofluidic assembly technique. The 200-nm-thick, 5- and 10-μm-diameter microdisk lasers are fabricated on InP and then released from the substrates. They are reassembled on a silicon platform using lateral-field optoelectronic tweezers (LOET). The assembled laser with 5-μm diameter exhibits a threshold pump power of 340 μW at room temperature under pulse condition. The heterogeneously-integrated InGaAsP-on-Si microdisk laser could provide the much needed optical source for CMOS-based silicon photonics. The small footprint and low power consumption make them attractive for optical interconnect applications. The optofluidic assembly technique enables efficient use of the III–V epitaxial materials in silicon photonic integrated circuits.

We present a free-space optical interconnect system capable of dynamic closed-loop optical alignment using a microlens scanner with a proportional integral and derivative controller. Electrostatic microlens scanners based on combdrive actuators are designed and characterized with vertical cavity surface emitting lasers (VCSELs) for adaptive optical beam tracking in the midst of mechanical vibration noise. The microlens scanners are fabricated on silicon-on-insulator wafers with a bulk micromachining process using deep reactive ion etching. We demonstrate dynamic optical beam positioning with a 700 Hz bandwidth and a maximum noise reduction of approximately 40 dB. Eye diagrams with a 1 Gb/s modulation rate are presented to demonstrate the improved optical link in the presence of mechanical noise.