UC Berkeley

Metal penetration into a solid electrolyte (SE) is one of the critical problems impeding the practical application of solid-state batteries. In this study, we investigate the conditions under which electronic conductivity of the SE can lead to metal deposition and fracture within the SE. Three different stages for void filling (metal plating initiation, metal growth, and metal compression) in the SE are identified. We show that a micron-size isolated void in the SE near the anode can be quickly filled in by metal and fractured when the developed pressure in the void grows larger than the maximum pressure the SE material can sustain. We find that the anode voltage and applied current density play a significant role in determining the vulnerability to metal deposition. We discuss several strategies to prevent electronic conductivity-driven metal propagation in electrolytes that are not fully dense, including the densified layers between the anode and SE.