Skip to main content
Open Access Publications from the University of California

Anomalous creep in Sn-rich solder joints

  • Author(s): Song, Ho Geon;
  • Morris Jr., John W.;
  • Hua, Fay
  • et al.

This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0,5Cu, Sn-0.7Cu and Sn10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

Main Content
For improved accessibility of PDF content, download the file to your device.
Current View