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Anomalous creep in Sn-rich solder joints

  • Author(s): Song, Ho Geon
  • Morris Jr., John W.
  • Hua, Fay
  • et al.
Abstract

This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0,5Cu, Sn-0.7Cu and Sn10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

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