Lawrence Berkeley National Laboratory
Anomalous creep in Sn-rich solder joints
- Author(s): Song, Ho Geon
- Morris Jr., John W.
- Hua, Fay
- et al.
This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0,5Cu, Sn-0.7Cu and Sn10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.