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A Low Profile Folded Dipole Antenna on a Reactive High Impedance Substrate
Abstract
We present a fully planar realization of a low profile dipole antenna placed on top of a high impedance substrate. The structure is made by three metal layers and it does not requires vias between the layers. The antenna is matched to 50 Ohms and has a gain of 7.1 dBi including all feed network losses. © 2009 IEEE.
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