A life cycle inventory for comparative assessment of assorted semiconductor device types is assembled using a library of process step-related information. In this paper, we present the structure of this library of energy use, material inputs and emissions data at the process equipment-level and facilities-scale, normalized per wafer. Selected results from a case study of a 130nm node CMOS device are presented and compared with a previous study of a comparable chip. Comparative production impacts of 6-layer and 8-layer CMOS devices are shown.
