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Open Access Publications from the University of California

Pad Contact Area Characterization in Chemical Mechanical Planarization

  • Author(s): Lee, Sunghoon
  • Dornfeld, David A
  • et al.

There are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these, the pad is considered as one of the most important parts because of its deterioration during polishing. However, a special purpose pad design has not been tried yet. In this paper, a fabrication process and prototype are detailed using micro molding technology. These are applied to pad design optimization pressure.

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