Skip to main content
eScholarship
Open Access Publications from the University of California

InGaAs-InP DHBTs for increased digital IC bandwidth having a 391-GHz f(T) and 505-GHz f max

  • Author(s): Griffith, Zach
  • Dahlstrom, M
  • Rodwell, MJW
  • Fang, X M
  • Lubyshev, D
  • Wu, Y
  • Fastenau, J M
  • Liu, W K
  • et al.
Abstract

InP-In0.53Ga0.47As-InP double heterojunction bipolar transistors (DHBT) have been designed for use in high bandwidth digital and analog circuits, and fabricated using a conventional mesa structure. These devices exhibit a maximum 391-GHz f(t), and 505-GHz f(max), which is the highest f(t) reported for an InP DHBT--as well as the highest simultaneous f(t) and f(max) for any mesa HBT. The devices have been aggressively scaled laterally for reduced base-collector capacitance Ccb. In addition, the base sheet resistance rho(s) along with the base and emitter contact resistivities rho(c) have been lowered. The DC current gain beta is approximate to 36 and BV,CEO = 5.1 V. The devices reported here employ a 30-nm highly doped InGaAs base, and a 150-nm collector containing an InGaAs-InAlAs superlattice grade at the base-collector junction. From this device design we also report a 142-GHz static frequency divider (a digital figure of merit for a device technology) fabricated on the same wafer. The divider operation is fully static, operating from f(clk) = 3 to 142.0 GHz while dissipating approximate to 800 mW of power in the circuit core. The circuit employs single-buffered emitter coupled logic (ECL) and inductive peaking. A microstrip wiring environment is employed for high interconnect density, and to minimize loss and impedance mismatch at frequencies > 100 GHz.

Many UC-authored scholarly publications are freely available on this site because of the UC Academic Senate's Open Access Policy. Let us know how this access is important for you.

Main Content
Current View