Skip to main content
eScholarship
Open Access Publications from the University of California

Wetting and interface integrity of Sn-Ag-Bi solder/Fe-42%Ni alloy system

  • Author(s): Hwang, C.-W.;
  • Suganuma, K.;
  • Saiz, E.;
  • Tomsia, A.P.
  • et al.
Abstract

The wetting and interfacial integrity of lead-free Sn-Ag and Sn-Ag-Bi solders with 42 alloy (Fe-42wt% Ni) were investigated. A tin-iron intermetallic layer formed at the interface and, during cooling, Ni3Sn4 platelets precipitated in the solder. After bonding, the Sn-3Ag joints have a eutectic microstructure, with a fine network of Ag3Sn particles surrounding large primary -Sn grains. Bismuth addition to Sn-3Ag improved wettability, but decreased the joint strength, owing to Bi segregation to the interface.

Main Content
For improved accessibility of PDF content, download the file to your device.
Current View