Skip to main content
eScholarship
Open Access Publications from the University of California

Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales

  • Author(s): Luo, Jianfeng
  • Dornfeld, David A
  • et al.
Abstract

Modeling and simulation are critical to transfer CMP from an engineering 'art' to an engineering 'science'. Research efforts in CMP modeling have been attempted in the last decade. There is an urgent need to review the current models including their limitations and future research directions systematically. In this paper, chemical mechanical planarization modeling is reviewed systematically, from particle scale to die and wafer scales.

Main Content
Current View