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Material Removal Mechanisms in Lapping and Polishing

  • Author(s): Evans, C. J.
  • Paul, E.
  • Dornfeld, David
  • Lucca, D. A.
  • Byrne, G.
  • Tricard, M.
  • Klocke, F.
  • Dambon, O.
  • Mullany, B. A.
  • et al.
Abstract

Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms, howeve, are poorly understood. Technological outputs (e.g., surface finish, sub-surface damage, part shape) and throughput of lapping and polishing processes are affected by a large number of variables. Individual processes are well controlled within individual enterprises, yet there appears to be little ability to predict process performance a priori. As a first step toward improving process modeling, this paper reviews the fundamental mechanisms of material removal in lapping and polishing processes and identifies key areas where further work is required.

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