Interfacial and near interfacial crack growth phenomena in metal bonded alumina
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Interfacial and near interfacial crack growth phenomena in metal bonded alumina

Abstract

Metal/ceramic interfaces can be found in many engineering applications including microelectronic packaging, multi-layered films, coatings, joints, and composite materials. In order to design reliable engineering systems that contain metal/ceramic interfaces, a comprehensive understanding of interfacial and near interfacial failure mechanisms is ncessary.

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