UC Riverside

Multilayer vias play a crucial role in the interconnection of different layers within electronic devices, enabling the transmission of signals and facilitating complex circuit designs. This abstract presents a comprehensive overview of the structural analysis and fabrication approach for multilayer vias, focusing on their importance, fabrication techniques, and characterization methods.

The abstract emphasizes the significance of multilayer vias as key components in modern electronic devices, enabling efficient signal transmission and improving overall circuit performance. It highlights the importance of understanding the structural properties of these vias to ensure their functionality and reliability.

The abstract also discusses various fabrication techniques employed for multilayer vias, such as deposition, lithography, and etching processes. It emphasizes the need for precise control and optimization of these fabrication steps to achieve high-quality vias with desired dimensional and geometric characteristics.

In addition, the abstract briefly mentions the characterization methods utilized to assess the structural properties of multilayer vias, such as optical microscopy, scanning electron microscopy (SEM), and atomic force microscopy (AFM). These characterization techniques provide valuable insights into the morphology, surface roughness, and dimensional accuracy of the fabricated vias.

Overall, this abstract serves as a concise overview of the structural analysis and fabrication approach for multilayer vias. It highlights the importance of understanding their structural properties, discusses key fabrication techniques, and briefly mentions the characterization methods used to assess their quality. This information provides a foundation for further research and development in the field of multilayer via technology.