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Reducing Microfluidic Very Large Scale Integration (mVLSI) Chip Area by Seam Carving.

  • Author(s): Crites, B
  • Kong, K
  • Brisk, P
  • Editor(s): Behjat, L
  • Han, J
  • Velev, MN
  • Chen, D
  • et al.
Abstract

This paper introduces a technique based on seam carving to reduce the area of microfluidic very large scale integration (mVLSI) chips. Seam carving repeatedly identi es small slices of the device that can be safely removed (carved) and patched without adversely a ecting device functionality. Using non-linear seam carving we achieve an average improvement of 4:28x in area utilization and an average reduction in fluid routing channel length of 53%.

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