UC Santa Barbara

High-angle annular dark-field imaging in scanning transmission electron microscopy and x-ray photoelectron spectroscopy were used to investigate thermal SiO2 layers doped with Hf by ion-implantation. Hf was mobile under the focused electron beam in the asimplanted samples. After annealing for 5 min at 1200 °C, clusters of crystalline HfO2 were observed that were a few nm in size and surrounded by residual Hf that had remained trapped in the SiO2. Hf was not mobile under the electron beam in the annealed samples. Further annealing caused an expansion of the SiO2 that was damaged by ionimplantation. Hf rearrangement was confined to the ion beam damaged regions of the SiO2 layer. No diffusion of Hf into the undamaged SiO2 was observed. The implications of the results for complementary metal-oxide-semiconductor transistors with HfO2 gate dielectrics are discussed.