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Open Access Publications from the University of California

Flexible Electronics: Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices (Adv. Funct. Mater. 40/2019)

  • Author(s): Martin, Andrew;
  • Chang, Boyce S;
  • Martin, Zachariah;
  • Paramanik, Dipak;
  • Frankiewicz, Christophe;
  • Kundu, Souvik;
  • Tevis, Ian D;
  • Thuo, Martin
  • et al.
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