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Self-assembled three dimensional network designs for soft electronics.

  • Author(s): Jang, Kyung-In
  • Li, Kan
  • Chung, Ha Uk
  • Xu, Sheng
  • Jung, Han Na
  • Yang, Yiyuan
  • Kwak, Jean Won
  • Jung, Han Hee
  • Song, Juwon
  • Yang, Ce
  • Wang, Ao
  • Liu, Zhuangjian
  • Lee, Jong Yoon
  • Kim, Bong Hoon
  • Kim, Jae-Hwan
  • Lee, Jungyup
  • Yu, Yongjoon
  • Kim, Bum Jun
  • Jang, Hokyung
  • Yu, Ki Jun
  • Kim, Jeonghyun
  • Lee, Jung Woo
  • Jeong, Jae-Woong
  • Song, Young Min
  • Huang, Yonggang
  • Zhang, Yihui
  • Rogers, John A
  • et al.
Abstract

Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

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