Fatigue of polycrystalline silicon for MEMS applications: Crack growth and stability under resonant loading conditions
Skip to main content
eScholarship
Open Access Publications from the University of California

Fatigue of polycrystalline silicon for MEMS applications: Crack growth and stability under resonant loading conditions

Abstract

Although bulk silicon is not known to exhibit susceptibility to cyclic fatigue, micron-scale structures made from silicon films are known to be vulnerable to degradation by fatigue in ambient air environments, a phenomenon that has been recently modeled in terms of a mechanism of sequential oxidation and stress-corrosion cracking of the native oxide layer.

Main Content
For improved accessibility of PDF content, download the file to your device.
Current View