Fatigue of polycrystalline silicon for MEMS applications: Crack growth and stability under resonant loading conditions
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Fatigue of polycrystalline silicon for MEMS applications: Crack growth and stability under resonant loading conditions

  • Author(s): Muhlstein, C.L.
  • Howe, R.T.
  • Ritchie, R.O.
  • et al.
Abstract

Although bulk silicon is not known to exhibit susceptibility to cyclic fatigue, micron-scale structures made from silicon films are known to be vulnerable to degradation by fatigue in ambient air environments, a phenomenon that has been recently modeled in terms of a mechanism of sequential oxidation and stress-corrosion cracking of the native oxide layer.

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