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Low-loss and Broadband G-Band Dielectric Interconnect for Chip-to-Chip Communication
Published Web Location
http://dart.ece.ucdavis.edu/publication/byu2016b.pdfNo data is associated with this publication.
Abstract
This paper presents a novel dielectric waveguide based G-band interconnect. By using a new transition of microstrip line to dielectric waveguide, the interconnect achieves low insertion loss and wide bandwidth. The measured minimum insertion loss is 4.9 dB with 9.7 GHz 1-dB bandwidth. Besides, the structure is based on standard micromachined processing and easy to integrate with conventional packaging.
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