UC Davis

This paper presents a dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications. By using a proposed new transition of microstrip line to dielectric waveguide, the interconnect channel achieves wide bandwidth on two orthogonal modes Ey11 and Ex11. To the authors' knowledge, this is the first demonstration of a multi-mode sub-THz interconnect channel. The measured minimum insertion losses for mode Ey11 and mode Ex11 are 8.0 dB with 21.3 GHz 3-dB bandwidth and 9.0 dB with 24.0 GHz 3-dB bandwidth, respectively.