Skip to main content
eScholarship
Open Access Publications from the University of California

Thermal and mechanical joints to cryo-cooled silicon monochromator crystals

  • Author(s): MacDowell, A.
  • Fakra, S.
  • Morrison, G.
  • et al.
Abstract

We describe the performance of various materials used as the thermal interface between silicon to silicon and silicon to copper joints when operated at ~;120K and loaded with ~;20 watts of thermal power. We find that only the indium based silicon-to-silicon joint is reliable.

Main Content
Current View