Thermal and mechanical joints to cryo-cooled silicon monochromator crystals
- Author(s): MacDowell, A.;
- Fakra, S.;
- Morrison, G.
- et al.
We describe the performance of various materials used as the thermal interface between silicon to silicon and silicon to copper joints when operated at ~;120K and loaded with ~;20 watts of thermal power. We find that only the indium based silicon-to-silicon joint is reliable.