Skip to main content
eScholarship
Open Access Publications from the University of California

UCLA

UCLA Previously Published Works bannerUCLA

Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration

  • Author(s): Wan, Zhe;
  • Winstel, Kevin;
  • Kumar, Arvind;
  • Iyer, Subramanian
  • et al.
Main Content
For improved accessibility of PDF content, download the file to your device.
Current View