Lawrence Berkeley National Laboratory

Crack-free joining of alumina and silicon nitride has been achieved by a unique approach introducing sialon polytypoids as a Functionally Graded Materials (FGM) bonding layer. The polytypoid compositions are identified in the phase diagram of the Si3N4-Al2O3system. The thermal stresses of this FGM junction were analyzed using a finite element analysis program (FEAP) taking into account both coefficient of thermal expansion (CTE) and modulus variations. From this analysis, the result showed a dramatic decrease in radial, axial and hoop stresses as the FGM changes from three layers to 20 graded layers. Scaling was considered, showing that the graded transition layer should constitute about 75% or more of the total sample thickness to reach a minimal residual stress. Oriented Vickers indentation testing was used to qualitatively characterize the strengths of the joint and the various interfaces. The indentation cracks were minimally or not deflected at the sialon layers, implying strong interfaces. Finally, flexural testing was conducted at room temperature and at high temperature. The average strength at room temperature was found to be 581 MPa and the average strength at high temperature (1200 degrees C) was found to be 262 MPa. Scanning electron microscope observation of fracture surfaces at a different loading rates indicated that the strength loss at higher temperatures was consistent with a softening of glassy materials present at grain junctions.