Thermal management of systems under high heat fluxes on the order of hundreds of W/cm^2 is important for the safety, performance and lifetime of devices, with innovative cooling technologies leading to improved performance of electronics or concentrating solar photovoltaics. A novel, spiraling radial inflow microchannel heat sink for high flux cooling applications, using a single phase or vaporizing coolant, has demonstrated enhanced heat transfer capabilities. The design of the heat sink provides an inward swirl flow between parallel, coaxial disks that form a microchannel of 1 cm radius and 300 micron channel height with a single inlet and a single outlet. The channel is heated on one side through a conducting copper surface, and is essentially adiabatic on the opposite side to simulate a heat sink scenario for electronics or concentrated photovoltaics cooling. Experimental results on the heat transfer and pressure drop characteristics in the heat sink, using single phase water as a working fluid, revealed heat transfer enhancements due to flow acceleration and induced secondary flows when compared to unidirectional laminar fully developed flow between parallel plates. Additionally, thermal gradients on the surface are small relative to the bulk fluid temperature gain, a beneficial feature for high heat flux cooling applications. Heat flux levels of 113 W/cm^2 at a surface temperature of 77 deg C were reached with a ratio of pumping power to heat rate of 0.03%. Analytical models on single phase flow are used to explore the parametric trends of the flow rate and passage geometry on the streamlines and pressure drop through the device.

Flow boiling heat transfer and pressure drop characteristics were obtained for this heat sink using water at near atmospheric pressure as the working fluid for inlet subcooling levels ranging from 20 to 80 deg C and mean mass flux levels ranging from 184-716 kg/m^2s. Flow enhancements similar to single phase flow were expected, as well as enhancements due to increased buoyant forces on vapor bubbles resulting from centripetal acceleration in the flow which will tend to draw the vapor towards the outlet. This can also aid in the reduction of vapor obstruction of the flow. The flow was identified as transitioning through three regimes as the heat rate was increased: partial subcooled flow boiling, oscillating boiling and fully developed flow boiling. During partial subcooled flow boiling, both forced convective and nucleate boiling effects are important. During oscillating boiling, the system fluctuated between partial subcooled flow boiling and fully developed nucleate boiling. Temperature and pressure oscillations were significant in this regime and are likely due to bubble constriction of flow in the microchannel. This regime of boiling is generally undesirable due to the large oscillations in temperatures and pressure and design constraints should be established to avoid large oscillations from occurring. During fully developed flow boiling, water vapor rapidly leaves the surface and the flow does not sustain large oscillations. Reducing inlet subcooling levels was found to reduce the magnitude of oscillations in the oscillating boiling regime. Additionally, reduced inlet subcooling levels reduced the average surface temperature at the highest heat flux levels tested when heat transfer was dominated by nucleate boiling, yet increased the average surface temperatures at low heat flux levels when heat transfer was dominated by forced convection. Experiments demonstrated heat fluxes up to 301 W/cm^2 at an average surface temperature of 134 deg C under partial subcooled flow boiling conditions. At this peak heat flux, the system required a pumping power to heat rate ratio of 0.01%. This heat flux is 2.4 times the typical values for critical heat flux in pool boiling under similar conditions.