Large-area epitaxial growth of III-V nanowires and thin films on van der Waals substrates is key to developing flexible optoelectronic devices. In our study, large-area InAs nanowires and planar structures are grown on hexagonal boron nitride templates using metal organic chemical vapor deposition method without any catalyst or pre-treatments. The effect of basic growth parameters on nanowire yield and thin film morphology is investigated. Under optimised growth conditions, a high nanowire density of 2.1×10⁹cm^-2is achieved. A novel growth strategy to achieve uniform InAs thin film on h-BN/SiO₂/Si substrate is introduced. The approach involves controlling the growth process to suppress the nucleation and growth of InAs nanowires, while promoting the radial growth of nano-islands formed on the h-BN surface. A uniform polycrystalline InAs thin film is thus obtained over a large area with a dominant zinc-blende phase. The film exhibits near-band-edge emission at room temperature and a relatively high Hall mobility of 399 cm^-2/(Vs). This work suggests a promising path for the direct growth of large-area, low-temperature III-V thin films on van der Waals substrates.

Crystalline silicon (c-Si) solar cells have been dominating the photovoltaic (PV) market for decades, and c-Si based photoelectrochemical (PEC) cells are regarded as one of the most promising routes for water splitting and renewable production of hydrogen. In this work, we demonstrate a nanoscale tantalum oxide (TaOx, ∼6 nm) as an electron-selective heterocontact, simultaneously providing high-quality passivation to the silicon surface and effective transport of electrons to either an external circuit or a water-splitting catalyst. The PV application of TaOx is demonstrated by a proof-of-concept device having a conversion efficiency of 19.1%. In addition, the PEC application is demonstrated by a photon-to-current efficiency (with additional applied bias) of 7.7%. These results represent a 2% and 3.8% absolute enhancement over control devices without a TaOx interlayer, respectively. The methods presented in this Letter are not limited to c-Si based devices and can be viewed as a more general approach to the interface engineering of optoelectronic and photoelectrochemical applications.