Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

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Open Access Publications from the University of California

Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

2018

Author(s): Fukushima, Takafumi
Alam, Arsalan
Hanna, Amir
Jangam, Siva
Bajwa, Adeel
Iyer, Subramanian
et al.

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