Imaging sensors and readout electronics have made tremendous strides in the past two decades. The application of modern semiconductor fabrication techniques and the introduction of customized monolithic integrated circuits have made large scale imaging systems routine in high energy physics. This technology is now finding its way into other areas, such as space missions, synchrotron light sources, and medical imaging. I review current developments and discuss the promise and limits of new technologies. Several detector systems are described as examples of future trends. The discussion emphasizes semiconductor detector systems, but I also include recent developments for large-scale superconducting detector arrays.
The development of planar fabrication techniques for superconducting transition-edge sensors has brought large-scale arrays of 1000 pixels or more to the realm of practicality. This raises the problem of reading out a large number of sensors with a tractable number of connections. A possible solution is frequency-domain multiplexing. I summarize basic principles, present various circuit topologies, and discuss design trade-offs, noise performance, cross-talk and dynamic range. The design of a practical device and its readout system is described with a discussion of fabrication issues, practical limits and future prospects.
Sophisticated front-end electronics are a key part of practically all modern radiation detector systems. This chapter introduces the basic principles and their implementation. Topics include signal acquisition, electronic noise, pulse shaping (analog and digital), and data readout techniques.
The past quarter century has brought about a revolution in front-end electronics for large-scale detector systems. Custom integrated circuits specifically tailored to the requirements of large detector systems have provided unprecedented performance and enabled systems that once were deemed impossible. The evolution of integrated circuit readouts in strip detectors is summarized, the present status described, and challenges posed by the sLHC and ILC are discussed. Performance requirements increase, but key considerations remain as in the past: power dissipation, material, and services. Smaller CMOS feature sizes will not provide the required electronic noise at lower power, but will improve digital power efficiency. Significant improvements appear to be practical in more efficient power distribution. Enhanced digital electronics have provided powerful trigger processors that greatly improve the trigger efficiency. In data readout systems they also improve data throughput, while reducing power requirements. Concurrently with new developments in high energy physics, detector systems for cosmology and astrophysics have made great strides. As an example, a large-scale readout for superconducting bolometer arrays is described.
This paper describes the AC-coupled, single-sided, p-in-n silicon microstrip sensors used in the Semiconductor Tracker (SCT) of the ATLAS experiment at the CERN Large Hadron Collider (LHC). The sensor requirements, specifications and designs are discussed, together with the qualification and quality assurance procedures adopted for their production. The measured sensor performance is presented, both initially and after irradiation to the fluence anticipated after 10 years of LHC operation. The sensors are now successfully assembled within the detecting modules of the SCT, and the SCT tracker is completed and integrated within the ATLAS Inner Detector. Hamamatsu Photonics Ltd. supplied 92.2percent of the 15,392 installed sensors, with the remainder supplied by CiS.
We describe the development of an antenna-coupled bolometer array for use in a Cosmic Microwave Background polarization experiment. Prototype single pixels using double-slot dipole antennas and integrated microstrip band defining filters have been built and tested. Preliminary results of optical testing and simulations are presented. A bolometer array design based on this pixel will also be shown and future plans for application of the technology will be discussed.