This paper introduces a technique based on seam carving to reduce the area of microuidic very large scale integration (mVLSI) chips. Seam carving repeatedly identifies small slices of the device that can be safely removed (carved) and patched without adversely affecting device functionality. Using non-linear seam carving we achieve an average improvement of 4:28x in area utilization and an average reduction in uid routing channel length of 53%.

This paper introduces a novel software framework to support automated development of paper-based microuidic devices. Compared to existing lab-on-a-chip technologies, paper-based microuidics difiers in terms of substrate technologies and point-of-care usage across a wide variety environmental conditions. This paper addresses the contexts in which the software can address these challenges and presents several initial case studies that demonstrate the capabilities of the framework to produce workable and usable paper microuidic devices.