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Strain mapping of three-dimensionally structured two-dimensional materials
- Mireles, Adan;
- Park, Jeongwon;
- Sung, Suk Hyun;
- Shi, Chuqiao;
- Shin, Bongki;
- Lou, Jun;
- Ophus, Colin;
- Hovden, Robert;
- Kang, Kibum;
- Han, Yimo
Published Web Location
https://doi.org/10.1126/sciadv.adz7908Abstract
Strain plays a crucial role in tuning materials' properties, influencing their optical, electrical, and chemical performances. In two-dimensional (2D) materials, applied stress often induces out-of-plane deformation, resulting in a more intricate three-dimensional (3D) topography, where mapping the strain remains a challenge due to the limitations of conventional characterization techniques. In this work, we introduce BRIGHT (Bragg-Rod Informed, Gradient-based Height-mapping Technique), an integrated method for reconstructing both the topography and planar strain profile of 3D-structured 2D materials using nanobeam four-dimensional scanning transmission electron microscopy (4D-STEM). We apply BRIGHT to a MoS2-MoSe2 transition metal dichalcogenide (TMD) lateral heterojunctions exhibiting built-in strain and out-of-plane ripples and show that varying heterojunction widths lead to distinct surface morphologies and corresponding changes in the planar strain distribution. These results establish a foundation for more effective strain engineering in 2D materials by accounting for out-of-plane structural features, thereby enabling more precise control of strain-dependent properties.
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