Precision Manufacturing Group
Parent: Laboratory for Manufacturing and Sustainability
eScholarship stats: Breakdown by Item for June through September, 2026
| Item | Title | Total requests | Download | View-only | %Dnld |
|---|---|---|---|---|---|
| 4h56k1ch | Advanced monitoring of machining operations | 648 | 339 | 309 | 52.3% |
| 4hw2r7qc | Material Removal Mechanisms in Lapping and Polishing | 468 | 245 | 223 | 52.4% |
| 29g1z2t6 | Wafer-Scale CMP Modeling of With-in Wafer Non-Uniformity | 370 | 50 | 320 | 13.5% |
| 8rf718jm | Recent Advances in Mechanical Micromachining | 324 | 182 | 142 | 56.2% |
| 7xx6j4s5 | Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process | 318 | 63 | 255 | 19.8% |
| 4ct2n4jh | Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales | 257 | 61 | 196 | 23.7% |
| 3wk862xb | Chip Scale Prediction of Nitride Erosion in High Selectivity STI CMP | 216 | 28 | 188 | 13.0% |
| 0pn4r425 | Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4 | 197 | 51 | 146 | 25.9% |
| 5tp0299m | Precision Manufacturing Process Monitoring With Acoustic Emission | 187 | 28 | 159 | 15.0% |
| 1kj2b95j | CMP Modeling as a part of Design for Manufacturing | 168 | 36 | 132 | 21.4% |
| 0n2575s1 | Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 1 | 153 | 29 | 124 | 19.0% |
| 4mz5893r | A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype - | 144 | 11 | 133 | 7.6% |
| 12q6g963 | Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents | 142 | 34 | 108 | 23.9% |
| 58r5204t | Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues | 141 | 56 | 85 | 39.7% |
| 40n7p86w | Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing | 137 | 51 | 86 | 37.2% |
| 2gz0f5hg | A model of material removal and post process surface topography for copper CMP | 132 | 38 | 94 | 28.8% |
| 12g571p1 | Graphical Mapping of AE for Pad Condition Monitoring in Copper CMP | 131 | 30 | 101 | 22.9% |
| 0dq919t9 | Modeling of Pressure Non-Uniformity at a Die Scale For ILD CMP | 129 | 34 | 95 | 26.4% |
| 7bd8p475 | In-Situ Acoustic Emission Monitoring of Surface Chemical Reactions for Copper CMP | 122 | 19 | 103 | 15.6% |
| 6th614qz | Technological Approaches in Nanopolishing for Microstructures | 121 | 24 | 97 | 19.8% |
| 9mp099gw | Surface finishes from turning and facing with round nosed tools | 121 | 73 | 48 | 60.3% |
| 73g339j3 | ADDRESSING PROCESS PLANNING AND VERIFICATION ISSUES WITH MTCONNECT | 117 | 33 | 84 | 28.2% |
| 06k6x1vm | Evaluation of the Effect of Pad Thickness and Stiffness on Pressure Non-Uniformity at Die-Scale in ILD CMP | 115 | 23 | 92 | 20.0% |
| 326856vn | Pad Contact Area Characterization in Chemical Mechanical Planarization | 115 | 20 | 95 | 17.4% |
| 8kb028c3 | Application of AE Contact Sensing in Reliable Grinding Monitoring | 115 | 37 | 78 | 32.2% |
| 1sp832mw | The influence of cutting edge sharpness on surface finish in facing with round nosed cutting tools | 102 | 49 | 53 | 48.0% |
| 6vn2918m | Opportunities and Challenges to Sustainable Manufacturing and CMP | 102 | 41 | 61 | 40.2% |
| 19s438ph | Conditioning Effect on Pad Surface Height Distribution in Copper CMP | 100 | 19 | 81 | 19.0% |
| 9nh338zg | Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization | 99 | 52 | 47 | 52.5% |
| 6dh3x4qr | Modification of surface properties on a nitride based coating films through mirror-quality finish grinding | 94 | 35 | 59 | 37.2% |
| 00s0d8v2 | Precision Manufacturing of Imprint Rolls for the Roller Imprinting Process | 89 | 20 | 69 | 22.5% |
| 50j5r9b3 | Trajectory generationinhigh-speed,high-precisionmicromillingusing subdivision curves | 87 | 32 | 55 | 36.8% |
| 97z7428c | Chip Scale Topography Evolution Model for CMP Process Optimization | 86 | 32 | 54 | 37.2% |
| 5rk639tt | Designing Imprint Rolls for Fluid Pathway Fabrication | 84 | 22 | 62 | 26.2% |
| 8v6445zj | Tribo-Chemical Modeling of Copper CMP | 79 | 13 | 66 | 16.5% |
| 1m1132dv | Scalability of Tool Path Planning to Micro Machining | 78 | 16 | 62 | 20.5% |
| 72h3d5nw | Improvingendmillingsurfacefinishbyworkpiecerotationandadaptive toolpathspacing | 77 | 41 | 36 | 53.2% |
| 9966p85j | Integrated Tribo-Chemical Modeling of Copper CMP | 76 | 17 | 59 | 22.4% |
| 602066ws | Modeling and simulation of material removal with particulate flows | 73 | 32 | 41 | 43.8% |
| 9dx0w8gz | A study on initial contact detection for precision micro-mold and surface generation of vertical side walls in micromachining | 66 | 17 | 49 | 25.8% |
| 26h4f034 | Variation in Machinability of Single Crystal Materials in Micromachining | 65 | 36 | 29 | 55.4% |
| 4tr859cp | CMP Modeling as a part of Design for Manufacturing | 65 | 20 | 45 | 30.8% |
| 76x709kc | MEMS Applications of CMP | 65 | 16 | 49 | 24.6% |
| 6991f42f | Variation in Machinability of Single Crystal Materials in Micromechanical Machining | 63 | 12 | 51 | 19.0% |
| 88h5r4qw | DESIGN AND FABRICATION OF A ROLLER IMPRINTING DEVICE FOR MICROFLUIDIC DEVICE MANUFACTURING | 63 | 23 | 40 | 36.5% |
| 1542q9pt | Design Rules for the Development of a New-Concept Pad | 57 | 15 | 42 | 26.3% |
| 8d02d2dd | Subdivision Surfaces for Procedural Design of Optimal Imprint Rolls | 51 | 21 | 30 | 41.2% |
| 2np9393g | Bicepstrum Based Blind Identification of the Acoustic Emission | 48 | 8 | 40 | 16.7% |
| 8x62k046 | Geometric Approaches for Reducing Burr Formation in Planar Milling by Avoiding Tool Exits | 47 | 25 | 22 | 53.2% |
| 2fs8q35q | On impinging near-field granular jets | 42 | 16 | 26 | 38.1% |
Note: Due to the evolving nature of web traffic, the data presented here should be considered approximate and subject to revision. Learn more.