Precision Manufacturing Group

Parent: Laboratory for Manufacturing and Sustainability

eScholarship stats: History by Item for May through August, 2026

Item	Title	Total requests	2026-08	2026-07	2026-06	2026-05
4h56k1ch	Advanced monitoring of machining operations	657	224	130	119	184
4hw2r7qc	Material Removal Mechanisms in Lapping and Polishing	479	143	127	99	110
29g1z2t6	Wafer-Scale CMP Modeling of With-in Wafer Non-Uniformity	380	140	42	99	99
8rf718jm	Recent Advances in Mechanical Micromachining	326	104	92	77	53
7xx6j4s5	Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process	298	130	36	70	62
4ct2n4jh	Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales	280	87	44	70	79
3wk862xb	Chip Scale Prediction of Nitride Erosion in High Selectivity STI CMP	242	64	43	66	69
5tp0299m	Precision Manufacturing Process Monitoring With Acoustic Emission	217	35	45	58	79
0pn4r425	Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4	172	59	27	50	36
1kj2b95j	CMP Modeling as a part of Design for Manufacturing	167	60	11	42	54
2gz0f5hg	A model of material removal and post process surface topography for copper CMP	157	34	38	32	53
40n7p86w	Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing	153	48	18	33	54
4mz5893r	A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype -	153	75	11	28	39
00s0d8v2	Precision Manufacturing of Imprint Rolls for the Roller Imprinting Process	151	29	12	24	86
0n2575s1	Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 1	151	39	9	47	56
58r5204t	Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues	150	42	21	37	50
6vn2918m	Opportunities and Challenges to Sustainable Manufacturing and CMP	139	29	20	35	55
12q6g963	Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents	137	61	16	27	33
0dq919t9	Modeling of Pressure Non-Uniformity at a Die Scale For ILD CMP	136	75	6	15	40
7bd8p475	In-Situ Acoustic Emission Monitoring of Surface Chemical Reactions for Copper CMP	130	47	12	19	52
9mp099gw	Surface finishes from turning and facing with round nosed tools	123	50	21	20	32
06k6x1vm	Evaluation of the Effect of Pad Thickness and Stiffness on Pressure Non-Uniformity at Die-Scale in ILD CMP	122	37	15	26	44
326856vn	Pad Contact Area Characterization in Chemical Mechanical Planarization	122	36	13	35	38
8kb028c3	Application of AE Contact Sensing in Reliable Grinding Monitoring	118	25	21	30	42
5rk639tt	Designing Imprint Rolls for Fluid Pathway Fabrication	116	25	12	27	52
73g339j3	ADDRESSING PROCESS PLANNING AND VERIFICATION ISSUES WITH MTCONNECT	111	32	23	23	33
6dh3x4qr	Modification of surface properties on a nitride based coating films through mirror-quality finish grinding	105	28	14	28	35
12g571p1	Graphical Mapping of AE for Pad Condition Monitoring in Copper CMP	103	42	7	16	38
19s438ph	Conditioning Effect on Pad Surface Height Distribution in Copper CMP	100	31	16	16	37
97z7428c	Chip Scale Topography Evolution Model for CMP Process Optimization	99	19	12	21	47
6th614qz	Technological Approaches in Nanopolishing for Microstructures	97	42	16	13	26
1sp832mw	The influence of cutting edge sharpness on surface finish in facing with round nosed cutting tools	96	34	17	24	21
9966p85j	Integrated Tribo-Chemical Modeling of Copper CMP	93	25	8	23	37
50j5r9b3	Trajectory generationinhigh-speed,high-precisionmicromillingusing subdivision curves	92	29	7	18	38
1m1132dv	Scalability of Tool Path Planning to Micro Machining	88	25	12	23	28
26h4f034	Variation in Machinability of Single Crystal Materials in Micromachining	87	15	19	21	32
88h5r4qw	DESIGN AND FABRICATION OF A ROLLER IMPRINTING DEVICE FOR MICROFLUIDIC DEVICE MANUFACTURING	87	22	7	18	40
4tr859cp	CMP Modeling as a part of Design for Manufacturing	84	23	6	20	35
72h3d5nw	Improvingendmillingsurfacefinishbyworkpiecerotationandadaptive toolpathspacing	83	21	18	16	28
9nh338zg	Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization	78	17	14	24	23
602066ws	Modeling and simulation of material removal with particulate flows	74	19	7	21	27
8v6445zj	Tribo-Chemical Modeling of Copper CMP	66	19	8	19	20
6991f42f	Variation in Machinability of Single Crystal Materials in Micromechanical Machining	65	13	11	17	24
9dx0w8gz	A study on initial contact detection for precision micro-mold and surface generation of vertical side walls in micromachining	62	23	11	16	12
76x709kc	MEMS Applications of CMP	55	14	8	13	20
1542q9pt	Design Rules for the Development of a New-Concept Pad	53	22	5	14	12
5f00043r	Analysis of Tool and Workpiece Interaction in Diamond Turning using Graphical Analysis of Acoustic Emission	52	13	7	10	22
2fs8q35q	On impinging near-field granular jets	48	13	9	11	15
8d02d2dd	Subdivision Surfaces for Procedural Design of Optimal Imprint Rolls	48	11	7	13	17
8x62k046	Geometric Approaches for Reducing Burr Formation in Planar Milling by Avoiding Tool Exits	46	12	9	7	18

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