Precision Manufacturing Group

Parent: Laboratory for Manufacturing and Sustainability

eScholarship stats: History by Item for June through September, 2026

Item	Title	Total requests	2026-09	2026-08	2026-07	2026-06
4h56k1ch	Advanced monitoring of machining operations	648	175	224	130	119
4hw2r7qc	Material Removal Mechanisms in Lapping and Polishing	468	99	143	127	99
29g1z2t6	Wafer-Scale CMP Modeling of With-in Wafer Non-Uniformity	370	89	140	42	99
8rf718jm	Recent Advances in Mechanical Micromachining	324	51	104	92	77
7xx6j4s5	Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process	318	82	130	36	70
4ct2n4jh	Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales	257	56	87	44	70
3wk862xb	Chip Scale Prediction of Nitride Erosion in High Selectivity STI CMP	216	43	64	43	66
0pn4r425	Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4	197	61	59	27	50
5tp0299m	Precision Manufacturing Process Monitoring With Acoustic Emission	187	49	35	45	58
1kj2b95j	CMP Modeling as a part of Design for Manufacturing	168	55	60	11	42
0n2575s1	Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 1	153	58	39	9	47
4mz5893r	A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype -	144	30	75	11	28
12q6g963	Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents	142	38	61	16	27
58r5204t	Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues	141	41	42	21	37
40n7p86w	Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing	137	38	48	18	33
2gz0f5hg	A model of material removal and post process surface topography for copper CMP	132	28	34	38	32
12g571p1	Graphical Mapping of AE for Pad Condition Monitoring in Copper CMP	131	66	42	7	16
0dq919t9	Modeling of Pressure Non-Uniformity at a Die Scale For ILD CMP	129	33	75	6	15
7bd8p475	In-Situ Acoustic Emission Monitoring of Surface Chemical Reactions for Copper CMP	122	44	47	12	19
6th614qz	Technological Approaches in Nanopolishing for Microstructures	121	50	42	16	13
9mp099gw	Surface finishes from turning and facing with round nosed tools	121	30	50	21	20
73g339j3	ADDRESSING PROCESS PLANNING AND VERIFICATION ISSUES WITH MTCONNECT	117	39	32	23	23
06k6x1vm	Evaluation of the Effect of Pad Thickness and Stiffness on Pressure Non-Uniformity at Die-Scale in ILD CMP	115	37	37	15	26
326856vn	Pad Contact Area Characterization in Chemical Mechanical Planarization	115	31	36	13	35
8kb028c3	Application of AE Contact Sensing in Reliable Grinding Monitoring	115	39	25	21	30
1sp832mw	The influence of cutting edge sharpness on surface finish in facing with round nosed cutting tools	102	27	34	17	24
6vn2918m	Opportunities and Challenges to Sustainable Manufacturing and CMP	102	18	29	20	35
19s438ph	Conditioning Effect on Pad Surface Height Distribution in Copper CMP	100	37	31	16	16
9nh338zg	Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization	99	44	17	14	24
6dh3x4qr	Modification of surface properties on a nitride based coating films through mirror-quality finish grinding	94	24	28	14	28
00s0d8v2	Precision Manufacturing of Imprint Rolls for the Roller Imprinting Process	89	24	29	12	24
50j5r9b3	Trajectory generationinhigh-speed,high-precisionmicromillingusing subdivision curves	87	33	29	7	18
97z7428c	Chip Scale Topography Evolution Model for CMP Process Optimization	86	34	19	12	21
5rk639tt	Designing Imprint Rolls for Fluid Pathway Fabrication	84	20	25	12	27
8v6445zj	Tribo-Chemical Modeling of Copper CMP	79	33	19	8	19
1m1132dv	Scalability of Tool Path Planning to Micro Machining	78	18	25	12	23
72h3d5nw	Improvingendmillingsurfacefinishbyworkpiecerotationandadaptive toolpathspacing	77	22	21	18	16
9966p85j	Integrated Tribo-Chemical Modeling of Copper CMP	76	20	25	8	23
602066ws	Modeling and simulation of material removal with particulate flows	73	26	19	7	21
9dx0w8gz	A study on initial contact detection for precision micro-mold and surface generation of vertical side walls in micromachining	66	16	23	11	16
26h4f034	Variation in Machinability of Single Crystal Materials in Micromachining	65	10	15	19	21
4tr859cp	CMP Modeling as a part of Design for Manufacturing	65	16	23	6	20
76x709kc	MEMS Applications of CMP	65	30	14	8	13
6991f42f	Variation in Machinability of Single Crystal Materials in Micromechanical Machining	63	22	13	11	17
88h5r4qw	DESIGN AND FABRICATION OF A ROLLER IMPRINTING DEVICE FOR MICROFLUIDIC DEVICE MANUFACTURING	63	16	22	7	18
1542q9pt	Design Rules for the Development of a New-Concept Pad	57	16	22	5	14
8d02d2dd	Subdivision Surfaces for Procedural Design of Optimal Imprint Rolls	51	20	11	7	13
2np9393g	Bicepstrum Based Blind Identification of the Acoustic Emission	48	22	19	1	6
8x62k046	Geometric Approaches for Reducing Burr Formation in Planar Milling by Avoiding Tool Exits	47	19	12	9	7
2fs8q35q	On impinging near-field granular jets	42	9	13	9	11

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